Shape memory alloy actuators and methods thereof

ABSTRACT

SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Patent Application 63/036,919 filed Jun. 9, 2020 and is a continuation-in-part of application U.S. patent application Ser. No. 16/775,207, filed on Jan. 28, 2020, which claims the priority from U.S. Provisional Patent Application 62/826,106 filed Mar. 29, 2019 and is a continuation-in-part application of U.S. patent application Ser. No. 15/971,995 filed on May 4, 2018, which claims the benefit of U.S. Provisional Patent Application No. 62/502,568, filed on May 5, 2017 and U.S. Provisional Patent Application No. 62/650,991, filed on Mar. 30, 2018, all of which are hereby incorporated by reference in their entireties.

FIELD

Embodiments of the invention relate to the field of shape memory alloy systems. More particularly, embodiments of the invention relate to the field of shape memory allow actuators and methods related thereto.

BACKGROUND

Shape memory alloy (“SMA”) systems have a moving assembly or structure that for example can be used in conjunction with a camera lens element as an auto-focusing drive. These systems may be enclosed by a structure such as a screening can. The moving assembly is supported for movement on a support assembly by a bearing such as plural balls. The flexure element, which is formed from metal such as phosphor bronze or stainless steel, has a moving plate and flexures. The flexures extend between the moving plate and the stationary support assembly and function as springs to enable the movement of the moving assembly with respect to the stationary support assembly. The balls allow the moving assembly to move with little resistance. The moving assembly and support assembly are coupled by four shape memory alloy (SMA) wires extending between the assemblies. Each of the SMA wires has one end attached to the support assembly, and an opposite end attached to the moving assembly. The suspension is actuated by applying electrical drive signals to the SMA wires. However, these type of systems are plagued by the complexity of the systems that result in bulky systems that require a large foot print and a large height clearance. Further, the present systems fails to provide high Z-stroke range with a compact, low profile footprint.

SUMMARY

SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.

A method of manufacturing a buckler module tilt OIS assembly comprising: providing a top buckler assembly configured to provide a yaw axis motion for dynamic tilt tuning capability; mounting an auto focus assembly to the top buckler assembly; mounting a sensor circuit PCB to the auto focus assembly at a side opposite of the top buckler assembly; thereby facilitating sensor circuit connections between the sensor circuit PCB and the auto focus assembly with a sensor bracket; coupling a bottom buckler assembly to the module circuit PCB opposite the auto focus assembly; and attaching the bottom buckler assembly to the top buckler assembly along the fixed perimeter.

The method, wherein the top buckler assembly includes a four-wire Buckler actuator.

The method, wherein the bottom buckler assembly includes a four-wire Buckler actuator.

The method, wherein the buckler module tilt OIS assembly is operable to provide two-axis camera module OIS tilt to move a moving mass to move to large tilt angles up to plus or minus 5 degrees.

The method, wherein the moving mass includes an auto focus assembly, a sensor circuit PCB, and a module circuit PCB.

The method, further comprising mounting an auto focus assembly to the top buckler assembly via adhesive.

The method, wherein the top buckler assembly includes one or more buckler arms, each buckler arm is positioned to cause the top buckler assembly to generate a yaw axis motion.

The method, wherein the bottom buckler assembly includes one or more buckler arms, each positioned to cause the bottom buckler assembly to generate a pitch axis motion.

The method, wherein the top buckler assembly and the bottom buckler assembly are operable to push away from each other to provide dynamic tilting of the buckler module tilt OIS assembly.

The method, further comprising providing the top buckler assembly that includes a housing with a top spring, a top autofocus carriage, a flexible sensor circuit, and a yaw tilt sub-assembly.

The method, wherein the yaw tilt sub-assembly includes a tilt sub-assembly buckler frame, a stainless-steel (SST) buckler frame, more than one slide bearings, at least one SMA wire, and an SST slide base.

The method, further comprising providing the bottom buckler assembly that includes a housing with a bottom spring, a bottom autofocus carriage, and a pitch tilt sub-assembly.

The method, wherein the pitch tilt sub-assembly includes a tilt sub-assembly buckler frame, a stainless-steel (SST) buckler frame, more than one slide bearings, at least one SMA wire, and an SST slide base.

Other features and advantages of embodiments of the present invention will be apparent from the accompanying drawings and from the detailed description that follows.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the present invention are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements and in which:

FIG. 1a illustrates a lens assembly including an SMA actuator configured as a buckle actuator according to an embodiment;

FIG. 1b illustrates an SMA actuator according to an embodiment;

FIG. 2 illustrates an SMA actuator according to an embodiment;

FIG. 3 illustrates an exploded view of an autofocus assembly including an SMA wire actuator according to an embodiment;

FIG. 4 illustrates the autofocus assembly including a SMA actuator according to an embodiment;

FIG. 5 illustrates an SMA actuator according to an embodiment including a sensor;

FIG. 6 illustrates a top view and a side view of an SMA actuator configured as a buckle actuator according to an embodiment fitted with a lens carriage;

FIG. 7 illustrates a side-view of a section of the SMA actuator according to the embodiment;

FIG. 8 illustrates multiple views of an embodiment of a buckle actuator;

FIG. 9 illustrates a bimorph actuator according to an embodiment with a lens carriage;

FIG. 10 illustrates a cutaway view of an autofocus assembly including an SMA actuator according to an embodiment;

FIGS. 11a-c illustrates views of bimorph actuators according to some embodiments;

FIG. 12 illustrates views of an embodiment of a bimorph actuator according to an embodiment;

FIG. 13 illustrates an end pad cross-section of a bimorph actuator according to an embodiment;

FIG. 14 illustrates a center supply pad cross-section of a bimorph actuator according to an embodiment;

FIG. 15 illustrates an exploded view of an SMA actuator including two buckle actuators according to an embodiment;

FIG. 16 illustrates an SMA actuator including two buckle actuators according to an embodiment;

FIG. 17 illustrates a side view of an SMA actuator including two buckle actuators according to an embodiment;

FIG. 18 illustrates a side view of an SMA actuator including two buckle actuators according to an embodiment;

FIG. 19 illustrates an exploded view an assembly including an SMA actuator including two buckle actuator according to an embodiment;

FIG. 20 illustrates an SMA actuator including two buckle actuators according to an embodiment;

FIG. 21 illustrates an SMA actuator including two buckle actuators according to an embodiment;

FIG. 22 illustrates an SMA actuator including two buckle actuators according to an embodiment;

FIG. 23 illustrates a SMA actuator including two buckle actuators and a coupler according to an embodiment;

FIG. 24 illustrates an exploded view of an SMA system including an SMA actuator including a buckle actuator with a laminate hammock according to an embodiment;

FIG. 25 illustrates an SMA system including an SMA actuator including a buckle actuator 2402 with a laminate hammock according to an embodiment;

FIG. 26 illustrates a buckle actuator including a laminate hammock according to an embodiment;

FIG. 27 illustrates a laminate hammock of an SMA actuator according to an embodiment;

FIG. 28 illustrates a laminate formed crimp connection of an SMA actuator according to an embodiment;

FIG. 29 illustrates an SMA actuator including a buckle actuator with a laminate hammock;

FIG. 30 illustrates an exploded view of an SMA system including an SMA actuator including a buckle actuator according to an embodiment;

FIG. 31 illustrates an SMA system including an SMA actuator including a buckle actuator according to an embodiment;

FIG. 32 illustrates an SMA actuator including a buckle actuator according to an embodiment;

FIG. 33 illustrates a two yoke capture joint of a pair of buckle arms of an SMA actuator according to an embodiment;

FIG. 34 illustrates a resistance weld crimp for an SMA actuator according to an embodiment used to attach an SMA wire to the buckle actuator;

FIG. 35 illustrates an SMA actuator including a buckle actuator with a two yoke capture joint;

FIG. 36 illustrates a SMA bimorph liquid lens according to an embodiment;

FIG. 37 illustrates a perspective SMA bimorph liquid lens according to an embodiment;

FIG. 38 illustrates a cross-section and a bottom view of SMA bimorph liquid lens according to an embodiment;

FIG. 39 illustrates an SMA system including an SMA actuator with bimorph actuators according to an embodiment;

FIG. 40 illustrates the SMA actuator with bimorph actuators according to an embodiment;

FIG. 41 illustrates the length of a bimorph actuator and the location of a bonding pad for an SMA wire to extend the wire length beyond the bimorph actuator;

FIG. 42 illustrates an exploded view of an SMA system including an bimorph actuator according to an embodiment;

FIG. 43 illustrates an exploded view of a subsection of the SMA actuator according to an embodiment;

FIG. 44 illustrates a subsection of the SMA actuator according to an embodiment;

FIG. 45 illustrates a 5 axis sensor shift system according to an embodiment;

FIG. 46 illustrates an exploded view of a 5 axis sensor shift system according to an embodiment;

FIG. 47 illustrates an SMA actuator including bimorph actuators integrated into this circuit for all motion according to an embodiment;

FIG. 48 illustrates an SMA actuator including bimorph actuators integrated into this circuit for all motion according to an embodiment;

FIG. 49 illustrates a cross section of a 5 axis sensor shift system according to an embodiment;

FIG. 50 illustrates an SMA actuator according to an embodiment including bimorph actuators;

FIG. 51 illustrates a top view of an SMA actuator according to an embodiment including bimorph actuators that moved an image sensor in different x and y positions;

FIG. 52 illustrates an SMA actuator including bimorph actuators according to an embodiment configured as a box bimorph autofocus;

FIG. 53 illustrates an SMA actuator including bimorph actuators according to an embodiment;

FIG. 54 illustrates an SMA actuator including bimorph actuators according to an embodiment;

FIG. 55 illustrates an SMA actuator including bimorph actuators according to an embodiment;

FIG. 56 illustrates a SMA system including a SMA actuator according to an embodiment including bimorph actuators;

FIG. 57 illustrates an exploded view of SMA system including a SMA actuator according to an embodiment including bimorph actuators configured as a two axis lens shift OIS;

FIG. 58 illustrates a cross-section of SMA system including a SMA actuator according to an embodiment including bimorph actuators configured as a two axis lens shift OIS;

FIG. 59 illustrates a box bimorph actuator according to an embodiment;

FIG. 60 illustrates a SMA system including a SMA actuator according to an embodiment including bimorph actuators;

FIG. 61 illustrates an exploded view of SMA system including a SMA actuator according to an embodiment including bimorph actuators;

FIG. 62 illustrates a cross-section of SMA system including a SMA actuator according to an embodiment including bimorph actuators;

FIG. 63 illustrates box bimorph actuator according to an embodiment;

FIG. 64 illustrates a SMA system including a SMA actuator according to an embodiment including bimorph actuators;

FIG. 65 illustrates an exploded view of a SMA system including a SMA actuator according to an embodiment including bimorph actuators;

FIG. 66 illustrates a SMA system including a SMA actuator according to an embodiment including bimorph actuators;

FIG. 67 illustrates a SMA system including a SMA actuator according to an embodiment including bimorph actuators;

FIG. 68 illustrates a SMA system including a SMA actuator according to an embodiment including bimorph actuators;

FIG. 69 illustrates an exploded view of SMA including a SMA actuator according to an embodiment including bimorph actuators;

FIG. 70 illustrates a cross-section of SMA system including a SMA actuator according to an embodiment including bimorph actuators configured as a three axis sensor shift OIS;

FIG. 71 illustrates a box bimorph actuator component according to an embodiment;

FIG. 72 illustrates a flexible sensor circuit for use in a SMA system according to an embodiment;

FIG. 73 illustrates a SMA system including a SMA actuator according to an embodiment including bimorph actuators;

FIG. 74 illustrates an exploded view of SMA system including a SMA actuator according to an embodiment including bimorph actuators;

FIG. 75 illustrates a cross-section of SMA system including a SMA actuator according to an embodiment;

FIG. 76 illustrates box bimorph actuator according to an embodiment;

FIG. 77 illustrates a flexible sensor circuit for use in a SMA system according to an embodiment;

FIG. 78 illustrates a SMA system including a SMA actuator according to an embodiment including bimorph actuators;

FIG. 79 illustrates an exploded view of SMA system including a SMA actuator according to an embodiment including bimorph actuators;

FIG. 80 illustrates a cross-section of SMA system including a SMA actuator according to an embodiment;

FIG. 81 illustrates box bimorph actuator according to an embodiment;

FIG. 82 illustrates a flexible sensor circuit for use in a SMA system according to an embodiment;

FIG. 83 illustrates a SMA system including a SMA actuator according to an embodiment including bimorph actuators;

FIG. 84 illustrates an exploded view of SMA system including a SMA actuator according to an embodiment;

FIG. 85 illustrates a cross-section of SMA system including a SMA actuator according to an embodiment including bimorph actuators;

FIG. 86 illustrates box bimorph actuator for use in a SMA system according to an embodiment;

FIG. 87 illustrates a flexible sensor circuit for use in a SMA system according to an embodiment;

FIG. 88 illustrates exemplary dimensions for a bimorph actuator of an SMA actuator according to embodiments;

FIG. 89 illustrates a lens system for a folded camera according to an embodiment;

FIG. 90 illustrates several embodiments of a lens systems including liquid lenses according to an embodiment;

FIG. 91 illustrates a folding lens that is a prism, which is disposed on an actuator, according to an embodiment;

FIG. 92 illustrates a bimorph arm with an offset according to an embodiment;

FIG. 93 illustrates a bimorph arm with an offset and a limiter according to an embodiment;

FIG. 94 illustrates a bimorph arm with an offset and a limiter according to an embodiment;

FIG. 95 illustrates an embodiment of a base including a bimorph arm with an offset according to an embodiment;

FIG. 96 illustrates an embodiment of a base including two bimorph arms with an offset according to an embodiment;

FIG. 97 illustrates a buckler arm including load point extensions according to an embodiment;

FIG. 98 illustrates a buckler arm 9801 including load point extensions 9810 according to an embodiment;

FIG. 99 illustrates a bimorph arm including load point extensions according to an embodiment;

FIG. 100 illustrates a bimorph arm including load point extensions according to an embodiment;

FIG. 101 illustrates an SMA optical image stabilizer according to an embodiment;

FIG. 102 illustrates an SMA material attach portion 40 of a moving portion according to an embodiment;

FIG. 103 illustrates an SMA attach portion of a static plate with resistance welded SMA wires attached thereto according to an embodiment;

FIG. 104 illustrates an SMA actuator 45 including a buckle actuator according to an embodiment;

FIGS. 105a-b illustrate a resistance weld crimp including an island for an SMA actuator according to an embodiment;

FIG. 106 illustrates the relationship between the bend plane z offset, the trough width, and the peak force of a bimorph beam according to an embodiment;

FIG. 107 illustrates examples of how a box volume which is an approximation of a box that encompasses the entire bimorph actuator according to an embodiment is related to the work per bimorph component;

FIG. 108 illustrates a liquid lens actuated using buckler actuators according to an embodiment;

FIG. 109 illustrates an unfixed, load point end of a bimorph arm according to an embodiment;

FIG. 110 illustrates an unfixed, load point end of a bimorph arm according to an embodiment;

FIG. 111 illustrates an unfixed, load point end of a bimorph arm according to an embodiment;

FIG. 112 illustrates an unfixed, load point end of a bimorph arm according to an embodiment;

FIG. 113 illustrates a fixed end of a bimorph arm according to an embodiment;

FIG. 114 illustrates a fixed end of a bimorph arm according to an embodiment;

FIG. 115 illustrates a fixed end of a bimorph arm according to an embodiment;

FIG. 116 illustrates a fixed end of a bimorph arm according to an embodiment;

FIG. 117 illustrates a backside view of a fixed end of a bimorph arm according to an embodiment;

FIG. 118 illustrates an exploded view of a buckler module tilt OIS assembly, according to an embodiment;

FIG. 119 illustrates an assembled view of the buckler module tilt OIS assembly of FIG. 118, according to an embodiment;

FIG. 120 illustrates forces applied to the buckler module tilt OIS assembly of FIG. 118, according to an embodiment;

FIG. 121 illustrates a tilting result of the forces applied to the buckler module tilt OIS assembly of FIG. 118, according to an embodiment;

FIG. 122 illustrates an exploded view of a top buckler assembly of the buckler module tilt OIS assembly of FIG. 118, according to an embodiment;

FIG. 122 illustrates an exploded view of a top buckler assembly of the buckler module tilt OIS assembly of FIG. 118, according to an embodiment;

FIG. 123 illustrates an exploded view of a bottom buckler assembly of the buckler module tilt OIS assembly of FIG. 118, according to an embodiment;

FIG. 124A illustrates an exploded view of a partially assembled buckler module tilt OIS assembly of FIG. 118, according to an embodiment;

FIG. 124B illustrates an assembled view of the partially assembled buckler module tilt OIS assembly of FIG. 124A, according to an embodiment;

FIG. 125 illustrates a front view of the partially assembled buckler module tilt OIS assembly of FIG. 124A, according to an embodiment;

FIG. 126 illustrates the assembly process of the buckler module tilt OIS assembly of FIG. 118, according to an embodiment;

FIG. 127 illustrates the assembly process of the buckler module tilt OIS assembly of FIG. 118, according to an embodiment;

FIG. 128 illustrates flexible sensor circuits of the buckler module tilt OIS assembly of FIG. 118, according to an embodiment;

FIG. 129 illustrates flexible sensor circuits of the buckler module tilt OIS assembly of FIG. 118, according to an embodiment;

FIG. 130 illustrates flexible sensor circuits of the buckler module tilt OIS assembly of FIG. 118, according to an alternative embodiment;

FIG. 131 illustrates flexible sensor circuits of the buckler module tilt OIS assembly of FIG. 118, according to an alternative embodiment;

FIG. 132 illustrates an assembled view of a buckler module tilt OIS assembly, according to an alternative embodiment;

FIG. 133 illustrates an assembled view of a buckler module tilt OIS assembly, according to an alternative embodiment;

FIG. 134 illustrates an underside of the assembled view of a buckler module tilt OIS assembly of FIG. 133, according to an alternative embodiment;

FIG. 135 illustrates a footprint of the dimensions of the AF assembly, according to an embodiment;

FIG. 136 illustrates a SMA module tilt OIS assembly, according to an embodiment;

FIG. 137 illustrates the SMA module tilt OIS assembly of FIG. 136 under directional deformity, according to an embodiment;

FIG. 138 illustrates a flexible sensor circuit of the buckler module tilt OIS assembly of FIG. 136, according to an embodiment;

FIG. 139 illustrates a buckler module tilt OIS assembly 1 including a single housing according to an embodiment;

FIG. 140 illustrates an exploded view of an a buckler module tilt OIS assembly including a single housing according to an embodiment;

FIG. 141 illustrates a buckler module tilt OIS according to an embodiment;

FIG. 142 illustrates internal components, such as those described herein, of a buckler module tilt OIS according to an embodiment;

FIG. 143 illustrates a top spring according to an embodiment;

FIG. 144 illustrates a bottom spring according to an embodiment;

FIG. 145 illustrates a flexible sensor circuit coupled to a module of a buckler module tilt OIS assembly according to an embodiment;

FIG. 146 illustrates a flexible sensor circuit according to the embodiment illustrated in FIG. 145 including a base cap;

FIG. 147 illustrates a buckler module tilt OIS assembly according to an embodiment without a housing and base cap;

FIG. 148 illustrates a bottom view of a module including a flexible sensor circuit according to an embodiment;

FIG. 149 illustrates a side view and a bottom view of a module including a flexible sensor circuit according to an embodiment; and

FIG. 150 illustrates a side view and a bottom view of a module including a flexible sensor circuit according to an embodiment.

DETAILED DESCRIPTION

Embodiments of an SMA actuator are described herein that include a compact footprint and providing a high actuation height, for example movement in the positive z-axis direction (z-direction), referred to herein as the z-stroke. Embodiments of the SMA actuator include an SMA buckle actuator and an SMA bimorph actuator. The SMA actuator may be used in many applications including, but not limited to, a lens assembly as an autofocus actuator, a micro-fluidic pump, a sensor shift, optical image stabilization, optical zoom assembly, to mechanically strike two surfaces to create vibration sensations typically found in haptic feedback sensors and devices, and other systems where an actuator is used. For example, embodiments of an actuator described herein could be used as a haptic feedback actuator for use in cellphones or wearable devices configured to provide the user an alarm, notification, alert, touched area or pressed button response. Further, more than one SMA actuator could be used in a system to achieve a larger stroke.

For various embodiments, the SMA actuator has a z-stroke that is greater than 0.4 millimeters. Further, the SMA actuator for various embodiments has a height in the z-direction of 2.2 millimeters or less, when the SMA actuator is in its initial, a de-actuated position. Various embodiments of the SMA actuator configured as an autofocus actuator in a lens assembly may have a footprint as small as 3 millimeters greater than the lens inner diameter (“ID”). According to various embodiments, the SMA actuator may have a footprint that is wider in one direction to accommodate components including, but not limited to, sensors, wires, traces, and connectors. According to some embodiments, the footprint of an SMA actuator is 0.5 millimeters greater in one direction, for example the length of the SMA actuator is 0.5 millimeters greater than the width.

FIG. 1a illustrates a lens assembly including an SMA actuator configured as a buckle actuator according to an embodiment. FIG. 1b illustrates an SMA actuator configured as a buckle actuator according to an embodiment. The buckle actuators 102 are coupled with a base 101. As illustrated in FIG. 1b , SMA wires 100 are attached to buckle actuators 102 such that when the SMA wires 100 are actuated and contract this causes the buckle actuators 102 to buckle, which results in at least the center portion 104 of each buckle actuator 102 to move in the z-stroke direction, for example the positive z-direction, as indicated by the arrows 108. According to some embodiments, the SMA wires 100 are actuated when electrical current is supplied to one end of the wire through a wire retainer such as a crimp structure 106. The current flows through the SMA wire 100 heating it due to the resistance inherent in the SMA material of which the SMA wire 100 is made. The other side of the SMA wire 100 has a wire retainer such as a crimp structure 106 that connects the SMA wire 100 to complete the circuit to ground. Heating of the SMA wire 100 to a sufficient temperature causes the unique material properties to change from martensite to austenite crystalline structure, which causes a length change in the wire. Changing the electrical current changes the temperature and therefore changes the length of the wire, which is used to actuate and de-actuate the actuator to control the movement of the actuator in at least the z-direction. One skilled in the art would understand that other techniques could be used to provide electrical current to an SMA wire.

FIG. 2 illustrates an SMA actuator configured as an SMA bimorph actuator according to an embodiment. As illustrated in FIG. 2, the SMA actuator includes bimorph actuators 202 coupled with a base 204. The bimorph actuators 202 include an SMA ribbon 206. The bimorph actuators 202 are configured to move at least the unfixed ends of the bimorph actuators 202 in the z-stroke direction 208 as the SMA ribbon 206 shrinks.

FIG. 3 illustrates an exploded view of an autofocus assembly including an SMA actuator according to an embodiment. As illustrated, an SMA actuator 302 is configured as a buckle actuator according to embodiments described herein. The autofocus assembly also includes optical image stabilization (“OIS”) 304, a lens carriage 306 configured to hold one or more optical lens using techniques including those known in the art, a return spring 308, a vertical slide bearing 310, and a guide cover 312. The lens carriage 306 is configured to slide against the vertical slide bearing 310 as the SMA actuator 302 moves in the z-stroke direction, for example the positive z-direction, when the SMA wires are actuated and pull and buckle the buckle actuators 302 using techniques including those described herein. The return spring 308 is configured to apply a force in the opposite direction to the z-stroke direction on the lens carriage 306 using techniques including those known in the art. The return spring 308 is configured, according to various embodiments, to move the lens carriage 306 in the opposite direction of the z-stroke direction when the tension in the SMA wires is lowered as the SMA wire is de-actuated. When the tension in the SMA wires is lowered to the initial value, the lens carriage 306 moves to the lowest height in the z-stroke direction. FIG. 4 illustrates the autofocus assembly including an SMA wire actuator according to an embodiment illustrated in FIG. 3.

FIG. 5 illustrates an SMA wire actuator according to an embodiment including a sensor. For various embodiments, the sensor 502 is configured to measure the movement of the SMA actuator in the z-direction or the movement of a component that that SMA actuator is moving using techniques including those known in the art. The SMA actuator including one or more buckle actuators 506 configured to actuate using one or more SMA wires 508 similar to those described herein. For example, in the autofocus assembly described in reference to FIG. 4, the sensor is configured to determine the amount of movement the lens carriage 306 moves in the z-direction 504 from an initial position using techniques including those known in the art. According to some embodiments, the sensor is a tunnel magneto resistance (“TMR”) sensor.

FIG. 6 illustrates a top view and a side view of an SMA actuator 602 configured as a buckle actuator according to an embodiment fitted with a lens carriage 604. FIG. 7 illustrates a side-view of a section of the SMA actuator 602 according to the embodiment illustrated in FIG. 6. According to the embodiment illustrated in FIG. 7, the SMA actuator 602 includes a slide base 702. According to an embodiment, the slide base 702 is formed of metal, such as stainless steel, using techniques including those know in the art. However, one skilled in the art would understand that other materials could be used to form the slide base 702. Further, the slide base 702, according to some embodiments, has spring arms 612 coupled with the SMA actuator 602. According to various embodiments, spring arms 612 are configured to serve two functions. The first function is to help push on an object, for example a lens carriage 604, into a guide cover's vertical slide surface. For this example, the spring arms 612 preload the lens carriage 604 up against this surface ensuring that the lens will not tilt during actuation. For some embodiments, the vertical slide surfaces 708 are configured to mate with the guide cover. The second function of the spring arms 612 is to help pull the SMA actuator 602 back down, for example in the negative z-direction, after the SMA wires 608 move the SMA actuator 602 in the z-stroke direction, the positive z-direction. Thus, when the SMA wires 608 are actuated they contract to move the SMA actuator 602 in the z-stroke direction and the spring arms 612 are configured to move the SMA actuator 602 in the opposite direction of the z-stroke direction when the SMA wires 608 are de-actuated.

The SMA actuator 602 also includes a buckle actuator 710. For various embodiments, the buckle actuator 710 is formed of metal, such as stainless steel. Further, the buckle actuator 710 includes buckle arms 610 and one or more wire retainers 606. According to the embodiment illustrated in FIGS. 6 and 7, the buckle actuator 710 includes four wire retainers 606. The four wire retainers 606 are each configured to receive an end of an SMA wire 608 and retain the end of the SMA wire 608, such that the SMA wire 608 is affixed to the buckle actuator 710. For various embodiments, the four wire retainers 606 are crimps that are configured to clamp down on a portion of the SMA wire 608 to affix the wire to the crimp. One skilled in the art would understand that an SMA wire 608 may be affixed to a wire retainer 606 using techniques known in the art including, but not limited to, adhesive, solder, and mechanically affixed. The smart memory alloy (“SMA”) wires 608 extend between a pair of wire retainers 606 such that the buckle arms 610 of the buckle actuator 710 are configured to move when the SMA wires 608 are actuated which results in the pair of wire retainers 606 being pulled closer together. According to various embodiments, the SMA wires 608 are electrically actuated to move and control the position of the buckle arms 610 when a current is applied to the SMA wire 608. The SMA wire 608 is de-actuated when the electrical current is removed or below a threshold. This moves the pair or wire retainers 606 apart and the buckle arms 610 move in the opposite direction of that when the SMA wire 608 is actuated. According to various embodiments, the buckle arms 610 are configured to have an initial angle of 5 degrees with respect to the slide base 702 when the SMA wire is de-actuated in its initial position. And, at full stroke or when the SMA wire is fully actuated the buckle arms 610 are configured to have an angle of 10 to 12 degrees with respect to the slide base 702 according to various embodiments.

According to the embodiment illustrated in FIGS. 6 and 7, the SMA actuator 602 also includes slide bearings 706 configured between the slide base 702 and the wire retainers 606. The slide bearings 706 are configured to minimize any friction between the slide base 702 and a buckle arm 610 and/or a wire retainer 606. The slide bearings for some embodiments are affixed to the slide bearings 706. According to various embodiments the slide bearings are formed of polyoxymethylene (“POM”). One skilled in the art would understand that other structures could be used to lower any friction between the buckle actuator and the base.

According to various embodiments, the slide base 702 is configured to couple with an assembly base 704 such as an autofocus base for an autofocus assembly. The actuator base 704, according to some embodiments, includes an etched shim. Such an etched shim may be used to provide clearance for wires and crimps when the SMA actuator 602 is part of an assembly, such as an autofocus assembly.

FIG. 8 illustrates multiple views of an embodiment of a buckle actuator 802 with respect to an x-axis, a y-axis, and a z-axis. As oriented in FIG. 8, the buckle arms 804 are configured to move in the z-axis when the SMA wires are actuated and de-actuated as described herein. According to the embodiment illustrated in FIG. 8, the buckle arms 804 are coupled with each other through a center portion such as a hammock portion 806. A hammock portion 806, according to various embodiments, is configured to cradle a portion of an object that is acted upon by the buckle actuator, for example a lens carriage that is moved by the buckle actuator using techniques including those described herein. A hammock portion 806 is configured to provide lateral stiffness to the buckle actuator during actuation according to some embodiments. For other embodiments, a buckle actuator does not include a hammock portion 806. According to these embodiments, the buckle arms are configured to act on an object to move it. For example, the buckle arms are configured to act directly on features of a lens carriage to push it upward.

FIG. 9 illustrates an SMA actuator configured as an SMA bimorph actuator according to an embodiment. The SMA bimorph actuator includes bimorph actuators 902 including those described herein. According to the embodiment illustrated in FIG. 9, one end 906 of each of bimorph actuators 902 is affixed to a base 908. According to some embodiments, the one end 906 is welded to base 908. However, one skilled in the art would understand other techniques could be used to affix the one end 906 to the base 908. FIG. 9 also illustrates a lens carriage 904 arranged such that the bimorph actuators 902 are configured to curl in the z-direction when actuated and lift the carriage 904 in the z-direction. For some embodiments, a return spring is used to push the bimorph actuators 902 back to an initial position. A return spring may be configured as described herein to aide in pushing the bimorph actuator down to their initial, de-actuated positions. Because of the small footprint of the bimorph actuators, SMA actuators can be made that have a reduced footprint over current actuator technologies.

FIG. 10 illustrates a cutaway view of an autofocus assembly including an SMA actuator according to an embodiment that includes a position sensor, such as a TMR sensor. The autofocus assembly 1002 includes a position sensor 1004 attached to a moving spring 1006, and a magnet 1008 attached to a lens carriage 1010 of an autofocus assembly including an SMA actuator, such as those described herein. The position sensor 1004 is configured to determine the amount of movement the lens carriage 1010 moves in the z-direction 1005 from an initial position based on a distance that the magnet 1008 is from the position sensor 1004 using techniques including those known in the art. According to some embodiments, the position sensor 1004 is electrically coupled with a controller or a processor, such as a central processing unit, using a plurality of electrical traces on a spring arm of a moving spring 1006 of an optical image stabilization assembly.

FIG. 11a-c illustrates views of bimorph actuators according to some embodiments. According to various embodiments, a bimorph actuator 1102 includes a beam 1104 and one or more SMA materials 1106 such as an SMA ribbon 1106 b (e.g., as illustrated in a perspective view of a bimorph actuator including an SMA ribbon according to the embodiment of FIG. 11b ) or SMA wire 1106 a (e.g., as illustrated in a cross-section of a bimorph actuator including an SMA wire according to the embodiment of FIG. 11a ). The SMA material 1106 is affixed to the beam 1104 using techniques including those describe herein. According to some embodiments, the SMA material 1106 is affixed to a beam 1104 using adhesive film material 1108. Ends of the SMA material 1106, for various embodiments, are electrically and mechanically coupled with contacts 1110 configured to supply current to the SMA material 1106 using techniques including those known in the art. The contacts 1110 (e.g., as illustrated in FIGS. 11a and 11b ), according to various embodiments, are gold plated copper pads. According to embodiments, a bimorph actuator 1102 having a length of approximately 1 millimeter are configured to generate a large stroke and push forces of 50 millinewtons (“mN”) is used as part of a lens assembly, for example as illustrated in FIG. 11c . According to some embodiments, the use of a bimorph actuator 1102 having a length greater than 1 millimeter will generate more stroke but less force that that having a length of 1 millimeter. For an embodiment, a bimorph actuator 1102 includes a 20 micrometer thick SMA material 1106, a 20 micrometer thick insulator 1112, such as a polyimide insulator, and a 30 micrometer thick stainless steel beam 1104 or base metal. Various embodiments include a second insulator 1114 disposed between a contact layer including the contacts 1110 and the SMA material 1106. The second insulator 1114 is configured, according to some embodiments, to insulate the SMA material 1106 from portions of the contact layer not used as the contacts 1110. For some embodiments, the second insulator 1114 is a covercoat layer, such a polyimide insulator. One skilled in the art would understand that other dimensions and materials could be used to meet desired design characteristics.

FIG. 12 illustrates views of an embodiment of a bimorph actuator according to an embodiment. The embodiment as illustrated in FIG. 12 includes a center feed 1204 for applying power. Power is supplied at the center of the SMA material 1202 (wire or ribbon), such as that described herein. Ends of the SMA material 1202 are grounded to the beam 1206 or base metal as a return path at the end pads 1203. The end pads 1203 are electrically isolated from the rest of the contact layer 1214. According to embodiments, the close proximity of a beam 1206 or base metal to the SMA material 1202, such as an SMA wire, along the entire length of the SMA material 1202 provides faster cooling of the wire when current is turned off, that is the bimorph actuator is de-actuated. The result is a faster wire deactivation and actuator response time. The thermal profile of the SMA wire or ribbon is improved. For example, the thermal profile is more uniform such that a higher total current can be reliably delivered to the wire. Without a uniform heat sink, portions of the wire, such as a center region, may overheated and be damaged thus requiring a reduced current and reduced motion to reliably operate. The center feed 1204 provides the benefits of quicker wire activation/actuation (faster heating) and reduced power consumption (lower resistance path length) of the SMA material 1202 for faster response time. This allows a faster actuator motion and capability to operate at a higher movement frequency.

As illustrated in FIG. 12, the beam 1206 includes a center metal 1208 that is isolated from the rest of the beam 1206 to form the center feed 1204. An insulator 1210, such as those described herein, is disposed over the beam 1206. The insulator 1210 is configured to have one or more openings or vias 1212 to provide electrical access to the beam 1206, for example to couple a ground section 1214 b of the contact layer, and to provide contact to the center metal 1208 to form the center feed 1204. A contact layer 1214, such as those described herein, includes a power section 1214 a and a ground section 1214 b, according to some embodiments, to provide actuation/control signals to the bimorph actuator by way of a power supply contact 1216 and a ground contact 1218. A covercoat layer 1220, such as those described herein, is disposed over the contact layer 1214 to electrically isolate the contact layer except at portions of the contact layer 1214 where electrical coupling is desired (e.g., one or more contacts).

FIG. 13 illustrates an end pad cross-section of a bimorph actuator according to an embodiment as illustrated in FIG. 12. As described above, the end pad 1203 electrically isolated from the rest of the contact layer 1214 by way of a gap 1222 formed between the end pad 1203 and the contact layer 1214. The gap is formed, according to some embodiments, using etching techniques including those known in the art. The end pad 1203 includes a via section 1224 configured to electrically couple the end pad 1203 with the beam 1206. The via section 1224 formed in a via 1212 formed in the insulator 1210. The SMA material 1202 is electrically coupled to the end pad 1213. The SMA material 1202 can be electrically coupled to the end pad 1213 using technique including, but not limited to, solder, resistance welding, laser welding, and direct plating.

FIG. 14 illustrates a center feed cross-section of a bimorph actuator according to an embodiment as illustrated in FIG. 12. The center feed 1204 is electrically coupled with to a power supply through the contract layer 1214 and electrically and thermally coupled with the center metal 1208 by way of a via section 1226 in the center feed 1204 formed in a via 1212 formed in the insulator 1210.

The actuators described herein could be used to form an actuator assembly that uses multiple buckle and or multiple bimorph actuators. According to an embodiment, the actuators may be stacked on top of each other in order to increase a stroke distance that can be achieved.

FIG. 15 illustrates an exploded view of an SMA actuator including two buckle actuators according to an embodiment. Two buckle actuators 1302, 1304, according to embodiments described herein, are arranged with respect to each other to use their motion to oppose each other. For various embodiments, the two buckle actuators 1302, 1304 are configured to move in an inverse relation to each other to position a lens carriage 1306. For example, the first buckle actuator 1302 is configured to receive an inverse power signal of the power signal sent to the second buckle actuator 1304.

FIG. 16 illustrates an SMA actuator including two buckle actuators according to an embodiment. The buckle actuators 1302, 1304 are configured such that the buckle arms 1310, 1312 of each buckle actuator 1302, 1304 face each other and the slide base 1314, 1316 of each buckle actuator 1302, 1304 are an outer surface of the two buckle actuators. A hammock portion 1308 of each SMA actuators 1302, 1304, according to various embodiments, is configured to cradle a portion of an object that is acted upon by the one or more buckle actuators 1302, 1304, for example a lens carriage 1306 that is moved by the buckle actuators using techniques including those described herein.

FIG. 17 illustrates a side view of an SMA actuator including two buckle actuators according to an embodiment that illustrates the direction of the SMA wires 1318 that result in moving an object such as a lens carriage in a positive z direction or in an upwardly direction.

FIG. 18 illustrates a side view of an SMA actuator including two buckle actuators according to an embodiment that illustrates the direction of the SMA wires 1318 that result in moving an object such as a lens carriage in a negative z direction or in an downwardly direction.

FIG. 19 illustrates an exploded view an assembly including an SMA actuator including two buckle actuator according to an embodiment. The buckle actuators 1902, 1904 are configured such that the buckle arms 1910, 1912 of each buckle actuator 1902, 1904 are an outer surface of the two buckle actuators and the slide base 1914, 1916 of each buckle actuator 1902, 1904 face each other. A hammock portion 1908 of each SMA actuators 1902, 1904, according to various embodiments, is configured to cradle a portion of an object that is acted upon by the one or more buckle actuators 1902, 1904, for example a lens carriage 1906 that is moved by the buckle actuators using techniques including those described herein. For some embodiments, the SMA actuator includes a base portion 1918 configured to receive the second buckle actuator 1904. The SMA actuator may also include a cover portion 1920. FIG. 20 illustrates an SMA actuator including two buckle actuators according to an embodiment including a base portion and a cover portion.

FIG. 21 illustrates an SMA actuator including two buckle actuators according to an embodiment. For some embodiments, the buckle actuators 1902, 1904 are arranged with respect to each other such that the hammock portions 1908 of the first buckle actuator 1902 are rotated about 90 degrees from the hammock portions of the second buckle actuator 1904. The 90 degrees configuration enables pitch and roll rotation of an object, such as a lens carriage 1906. This provides better control over the movement of the lens carriage 1906. For various embodiments, differential power signals are applied to the SMA wires of each buckle actuator pair, which provides for pitch and roll rotation of the lens carriage for tilt OIS motion.

Embodiments of the SMA actuators including two buckle actuators remove the need to have a return spring. The use of two buckler actuators can improve/reduce hysteresis when using SMA wire resistance for positional feedback. The opposing force SMA actuators including two buckler actuators aid in more accurate position control due to lower hysteresis than those including a return spring. For some embodiments, such as the embodiment illustrated in FIG. 22, the SMA actuator including two buckle actuators 2202, 2204 provide 2-axis tilt using differential power to the left and right SMA wires 2218 a, 2218 b of each buckle actuator 2202, 2204. For example, a left SMA wire 2218 a is actuated with higher power than a right SMA wire 2218 b. This causes the left side of the lens carriage 2206 to move down and right side to move up (tilt). The SMA wires of the first buckle actuator 2202 are held at equal power, for some embodiments, to act as a fulcrum for the SMA wires 2218 a, 2218 b to differentially push against to cause tilt motion. Reversing the power signals applied to the SMA wires, for example applying equal power to the SMA wires of the second buckle actuator 2202 and using differential power to the left and right SMA wires 2218 a, 2218 b of the second buckle actuator 2204 results in a tilt of the lens carriage 2206 in the other direction. This provides the ability to tilt an object, such as a lens carrier, in either axis of motion or can tune out any tilt between the lens and sensor for good dynamic tilt, which leads to better picture quality across all pixels.

FIG. 23 illustrates a SMA actuator including two buckle actuators and a coupler according to an embodiment. The SMA actuator includes two buckle actuators such as those described herein. A first buckle actuator 2302 is configured to couple with a second buckle actuator 2304 using a coupler, such as a coupler ring 2305. The buckle actuators 2302, 2304 are arranged with respect to each other such that the hammock portions 2308 of the first buckle actuator 2302 are rotated about 90 degrees from the hammock portions 2309 of the second buckle actuator 2304. A payload for moving, such as a lens or lens assembly, is attached to a lens carriage 2306 configured to be disposed on a slide base of first buckle actuator 2302.

For various embodiments, equal power can be applied to the SMA wires of the first buckle actuator 2302 and the second buckle actuator 2304. This can result in maximizing the z stroke of the SMA actuator in the positive z-direction. For some embodiments, the stroke of the SMA actuator can have a z stroke equal to or greater than two times the stroke of other SMA actuators including two buckle actuators. For some embodiments, an additional spring can be added to for the two bucklers to push against to aid in pushing the actuator assembly and the payload back down when the power signals are removed from the SMA actuator. Equal and opposite power signals can be applied to the SMA wires of the first buckle actuator 2302 and the second buckle actuator 2304. This enables the SMA actuator to be moved in the positive z-direction by a buckle actuator and to be moved in the negative z-direction by a buckle actuator, which enables accurate control of the position of the SMA actuator. Further, equal and opposite power signals (differential power signals) can be applied to the left and right SMA wire of the first buckle actuator 2302 and the second buckle actuator 2304 to tilt an object, such as a lens carriage 2306 in the direction of at least one of two axis.

Embodiments of SMA actuator including the two buckle actuators and a coupler, such as that illustrated in FIG. 23, can be coupled with an additional buckle actuator and pairs of buckle actuators to achieve a desired stroke greater than that of the single SMA actuator.

FIG. 24 illustrates an exploded view of an SMA system including an SMA actuator including a buckle actuator with a laminate hammock according to an embodiment. As described herein, SMA systems, for some embodiments, are configured to be used in conjunction with one or more camera lens elements as an auto-focusing drive. As illustrated in FIG. 24, the SMA system includes a return spring 2403 configured, according to various embodiments, to move a lens carriage 2406 in the opposite direction of the z-stroke direction when the tension in the SMA wires 2408 is lowered as the SMA wire is de-actuated. The SMA system for some embodiments includes a housing 2409 configured to receive the return spring 2403 and to act a slide bearing to guide the lens carriage in the z-stroke direction. The housing 2409 is also configured to be disposed on the buckle actuator 2402. The buckle actuator 2402 includes a slide base 2401 similar to those described herein. The buckle actuator 2402 includes buckle arms 2404 coupled with a hammock portion, such as a laminated hammock 2406 formed of a laminate. The buckle actuator 2402 also includes a SMA wire attach structures such as a laminate formed crimp connection 2412.

As illustrated in FIG. 24, the slide base 2401 is disposed on an optional adaptor plate 2414. The adaptor plate is configured to mate the SMA system or the buckler actuator 2402 to another system, such as an OIS, additional SMA systems, or other components. FIG. 25 illustrates an SMA system 2501 including an SMA actuator including a buckle actuator 2402 with a laminate hammock according to an embodiment.

FIG. 26 illustrates a buckle actuator including a laminate hammock according to an embodiment. The buckle actuator 2402 includes buckle arms 2404. The buckle arms 2404 are configured to move in the z-axis when the SMA wires 2412 are actuated and de-actuated as described herein. The SMA wires 2408 are attached to the buckle actuator using laminate formed crimp connections 2412. According to the embodiment illustrated in FIG. 26, the buckle arms 2404 are coupled with each other through a center portion such as a laminate hammock 2406. A laminate hammock 2406, according to various embodiments, is configured to cradle a portion of an object that is acted upon by the buckle actuator, for example a lens carriage that is moved by the buckle actuator using techniques including those described herein.

FIG. 27 illustrates a laminate hammock of an SMA actuator according to an embodiment. For some embodiments, the laminate hammock 2406 material is a low stiffness material so it does not resist the actuation motion. For example, the laminate hammock 2406 is formed using a copper layer disposed on a first polyimide layer with a second polyimide layer disposed on the copper. For some embodiments, the laminate hammock 2406 is formed on buckle arms 2404 using deposition and etching techniques including those known in the art. For other embodiments, the laminate hammock 2406 is formed separately from the buckle arms 2404 and attached to the buckle arms 2404 using techniques including welding, adhesive, and other techniques known in the art. For various embodiments, glue or other adhesive is used on the laminate hammock 2406 to ensure the buckler arms 2404 stay in a position relative to a lens carriage.

FIG. 28 illustrates a laminate formed crimp connection of an SMA actuator according to an embodiment. The laminate formed crimp connection 2412 is configured to attach an SMA wire 2408 to the buckle actuator and to create an electrical circuit joint with the SMA wire 2408. For various embodiments, the laminated formed crimp connection 2412 includes a laminate formed of one or more layers of an insulator and one or more layers of a conductive layer formed on a crimp.

For example, a polyimide layer is disposed on at least a portion of the stainless steel portion forming a crimp 2413. A conductive layer, such as copper, is then disposed on the polyimide layer, which is electrically coupled with one or more signal traces 2415 disposed on the buckle actuator. Deforming the crimp to come in to contact with the SMA wire therein also puts the SMA wire in electrical contact with the conductive layer. Thus, the conductive layer coupled with the one or more signal traces is used to apply power signals to the SMA wire using techniques including those described herein. For some embodiments, a second polyimide layer is formed over the conductive layer in areas where the conductive layer will not come into contact with the SMA wire. For some embodiments, the laminated formed crimp connection 2412 is formed on a crimp 2413 using deposition and etching techniques including those known in the art. For other embodiments, laminated formed crimp connection 2412 and the one or more electrical traces are formed separately from the crimp 2413 and the buckle actuator and attached to the crimp 2412 and the buckle actuator using techniques including welding, adhesive, and other techniques known in the art.

FIG. 29 illustrates an SMA actuator including a buckle actuator with a laminate hammock. As illustrated in FIG. 29, when a power signal is applied the SMA wire contracts or shortens to move the buckle arms and the laminate hammock in the positive z-direction. The laminate hammock that is in contact with an object in turn moves that object, such as a lens carriage in the positive z-direction. When the power signal is decreased or removed the SMA wire lengthens and moving the buckle arms and the laminate hammock in a negative z-direction.

FIG. 30 illustrates an exploded view of an SMA system including an SMA actuator including a buckle actuator according to an embodiment. As described herein, SMA systems, for some embodiments, are configured to be used in conjunction with one or more camera lens elements as an auto-focusing drive. As illustrated in FIG. 30, the SMA system includes a return spring 3003 configured, according to various embodiments, to move a lens carriage 3005 in the opposite direction of the z-stroke direction when the tension in the SMA wires 3008 is lowered as the SMA wire is de-actuated. The SMA system, for some embodiments, includes a stiffner 3000 disposed on the return spring 3003. The SMA system for some embodiments includes a housing 3009 formed of two portions configured to receive the return spring 3003 and to act a slide bearing to guide the lens carriage in the z-stroke direction. The housing 3009 is also configured to be disposed on the buckle actuator 3002. The buckle actuator 3002 includes a slide base 3001 similar to those described herein is formed of two portions. The slide base 3001 is split to electrically isolate the 2 sides (for example 1 side is ground, other side is power) because, according to some embodiments, current flows to the wire through the slide base 3001 portions.

The buckle actuator 3002 includes buckle arms 3004. Each pair of buckle actuators 3002 are formed on a separate portion of the buckle actuator 3002. The buckle actuator 3002 also includes a SMA wire attach structures such as a resistance weld wire crimp 3012. The SMA system optionally includes a flex circuit 3020 for electrically coupling the SMA wires 3008 to one or more control circuits.

As illustrated in FIG. 30, the slide base 3001 is disposed on an optional adaptor plate 3014. The adaptor plate is configured to mate the SMA system or the buckler actuator 3002 to another system, such as an OIS, additional SMA systems, or other components. FIG. 31 illustrates an SMA system 3101 including an SMA actuator including a buckle actuator 3002 according to an embodiment.

FIG. 32 including an SMA actuator including a buckle actuator according to an embodiment. The buckle actuator 3002 includes buckle arms 3004. The buckle arms 3004 are configured to move in the z-axis when the SMA wires 3012 are actuated and de-actuated as described herein. The SMA wires 2408 are attached to the resistant weld wire crimps 3012. According to the embodiment illustrated in FIG. 32, the buckle arms 3004 are configured to mate with an object, such as a lens carriage, without a center portion using a two yoke capture joint.

FIG. 33 illustrates a two yoke capture joint of a pair of buckle arms of an SMA actuator according to an embodiment. FIG. 33 also illustrates plating pads used to attached the optional flex circuit to the sliding base. For some embodiments, the plating pads are formed using gold. FIG. 34 illustrates a resistance weld crimp for an SMA actuator according to an embodiment used to attach an SMA wire to the buckle actuator. For some embodiments, glue or adhesive can also be placed on top of the weld to aid in mechanical strength and work as a fatigue strain relief during operation and shock loading.

FIG. 35 illustrates an SMA actuator including a buckle actuator with a two yoke capture joint. As illustrated in FIG. 35, when a power signal is applied the SMA wire contracts or shortens to move the buckle arms in the positive z-direction. The two yoke capture joint is in contact with an object in turn moves that object, such as a lens carriage in the positive z-direction. When the power signal is decreased or removed the SMA wire lengthens and moving the buckle arms in a negative z-direction. The yoke capture feature ensures buckle arms stay in correct position relative to the lens carriage.

FIG. 36 illustrates a SMA bimorph liquid lens according to an embodiment. The SMA bimorph liquid lens 3501 includes a liquid lens subassembly 3502, a housing 3504, and a circuit with SMA actuators 3506. For various embodiments, the SMA actuators include 4 bimorph actuators 3508, such as embodiments described herein. The bimorph actuators 3508 are configured to push on a shaping ring 3510 located on a flexible membrane 3512. The ring warps the membrane 3512/liquid 3514 changing the light path through the membrane 3512/liquid 3514. A liquid contain ring 3516 is used to contain the liquid 3514 between the membrane 3512 and the lens 3518. Equal force from Bimorph actuators changes the focus point of the image in the Z direction (normal to lens) which allows it to work as an auto focus. Differential force from Bimorph actuators 3508 can move light rays in the X,Y axes directions which allows it to work as an optical image stabilizer according to some embodiments. Both OIS and AF functions could be achieved at the same time with proper controls to each actuator. For some embodiments, a 3 actuators are used. The circuit with SMA actuators 3506 includes one or more contacts 3520 for control signals to actuate the SMA actuators. According to some embodiments including 4 SMA actuators the circuit with SMA actuators 3506 includes 4 power circuit control contact for each SMA actuator and a common return contact.

FIG. 37 illustrates a perspective SMA bimorph liquid lens according to an embodiment. FIG. 38 illustrates a cross-section and a bottom view of SMA bimorph liquid lens according to an embodiment.

FIG. 39 illustrates an SMA system including an SMA actuator 3902 with bimorph actuators according to an embodiment. The SMA actuator 3902 includes 4 bimorph actuators using techniques described herein. Two of the bimorph actuators are configured as positive z-stroke actuators 3904 and two are configured as negative z-stroke actuators 3906 as illustrated in FIG. 40, which illustrates the SMA actuator 3902 with bimorph actuators according to an embodiment. The opposing actuators 3906, 3904 are configured to control motion in both directions over the entire stroke range. This provides the ability to tune control code to compensate for tilt. For various embodiments, two SMA wires 3908 attached to top of component enable the positive z-stroke displacement. Two SMA wires attached to a bottom of component enable the negative z-stroke displacement. For some embodiments, each bimorph actuators are attached to an object, such as a lens carriage 3910, using tabs to engage the object. The SMA system includes a top spring 3912 configured to provide stability of the lens carriage 3910 in axes perpendicular to the z-stroke axis, for example in the direction of the x axis and the y axis. Further, a top spacer 3914 is configured to be arranged between the top spring 3912 and the SMA actuator 3902. A bottom spacer 3916 is arranged between the SMA actuator 3902 and a bottom spring 3918. The bottom spring 3918 is configured to provide stability of the lens carriage 3910 in axes perpendicular to the z-stroke axis, for example in the direction of the x axis and the y axis. The bottom spring 3918 is configured to be disposed on a base 3920, such as those described herein.

FIG. 41 illustrates the length 4102 of a bimorph actuator 4103 and the location of a bonding pad 4104 for an SMA wire 4206 to extend the wire length beyond the bimorph actuator. Longer wire than bimorph actuator is used to increased stroke & force. Thus, the extension length 4108 of that the SMA wire 4206 beyond the bimorph actuator 4103 is used to set the stroke and force for the bimorph actuator 4103.

FIG. 42 illustrates an exploded view of an SMA system including a SMA bimorph actuator 4202 according to an embodiment. The SMA system, according to various embodiments, is configured to use separate metal materials and non-conductive adhesives to create one or more electrical circuits to power the SMA wires independently. Some embodiments have no AF size impact and include 4 bimorph actuators, such as those described herein. Two of the bimorph actuators are configured as positive z stroke actuators and two negative z stroke actuators. FIG. 43 illustrates an exploded view of a subsection of the SMA actuator according to an embodiment. The subsection includes a negative actuator signal connection 4302, a base 4304 with bimorph actuators 4306. The negative actuator signal connection 4302 includes a wire bond pad 4308 for connecting an SMA wire of a bimorph actuator 4306 using techniques including those described herein. The negative actuator signal connection 4302 is affixed to the base 4304 using an adhesive layer 4310. The subsection also includes a positive actuator signal connection 4314 with a wire bond pad 4316 for connecting an SMA wire 4312 of a bimorph actuator 4306 using techniques including those described herein. The positive actuator signal connection 4314 is affixed to the base 4304 using an adhesive layer 4318. Each of the base 4304, the negative actuator signal connection 4302, and the positive actuator signal connection 4314 are formed of metal, for example stainless steel. Connection pads 4322 on each of the base 4304, the negative actuator signal connection 4302, and the positive actuator signal connection 4314 are configured to electrically couple control signals and ground for actuating the bimorph actuator 4306 using techniques including those described herein. For some embodiments, the connection pads 4322 are gold plated. FIG. 44 illustrates a subsection of the SMA actuator according to an embodiment. For some embodiments, gold platted pads are formed on the stainless steel layer for solder bonding or other known electrical termination methods. Further, formed wire bond pads are used for signal joints to electrically couple the SMA wires for power signals.

FIG. 45 illustrates a 5 axis sensor shift system according to an embodiment. The 5 axis sensor shift system is configured to move an object, such as an image senor in 5 axis relative to one or more lens. This includes X/Y/Z axis translation and pitch/roll tilt. Optionally the system is configured to use only 4 axis with X/Y axis translation and pitch/roll tilt together with a separate AF on top to do Z motion. Other embodiments include the 5 axis sensor shift system configured to move one or more lens relative to an image sensor. Static lens stack mounted on top cover and inserts inside the ID (not touching the orange moving carriage inside) for some embodiments.

FIG. 46 illustrates an exploded view of a 5 axis sensor shift system according to an embodiment. The 5 axis sensor shift system includes 2 circuit components: a flexible sensor circuit 4602, bimorph actuator circuit 4604; and 8-12 bimorph actuators 4606 built on to the bimorph circuit component using techniques including those described herein. The 5 axis sensor shift system includes a moving carriage 4608 configured to hold one or more lenses and an outer housing 4610. The bimorph actuator circuit 4604 includes, according to an embodiment, includes 8-12 SMA actuators such as those described herein. The SMA actuators are configured to move the moving carriage 4608 in 5 axis, such as in an x-direction, a y-direction, a z-direction, pitch, and roll similar to other 5 axis systems described herein.

FIG. 47 illustrates an SMA actuator including bimorph actuators integrated into this circuit for all motion according to an embodiment. Embodiment of a SMA actuator can including 8-12 bimorph actuators 4606. However, other embodiments could include more or less. FIG. 48 illustrates an SMA actuator 4802 including bimorph actuators integrated into this circuit for all motion according to an embodiment partially formed to fit inside a corresponding outer housing 4804. FIG. 49 illustrates a cross section of a 5 axis sensor shift system according to an embodiment.

FIG. 50 illustrates an SMA actuator 5002 according to an embodiment including bimorph actuators. The SMA actuator 5002 is configured to use 4 side mounted SMA bimorph actuators 5004 to move an image sensor, lens, or other various payloads in the x and y direction. FIG. 51 illustrates a top view of an SMA actuator including bimorph actuators that moved an image sensor, lens, or other various payloads in different x and y positions.

FIG. 52 illustrates an SMA actuator including bimorph actuators 5202 according to an embodiment configured as a box bimorph autofocus. Four top and bottom mounted SMA bimorph actuators, such as those described herein, are configured to move together to create movement in the z-stroke direction for autofocus motion. FIG. 53 illustrates an SMA actuator including bimorph actuators according to an embodiment and which two top mounted bimorph actuators 5302 are configured to push down on one or more lens. FIG. 54 illustrates an SMA actuator including bimorph actuators according to an embodiment and which two bottom mounted bimorph actuators 5402 are configured to push up on one or more lens. FIG. 55 illustrates an SMA actuator including bimorph actuators according to an embodiment to show the four top and bottom mounted SMA bimorph actuators 5502, such as those described herein, are used to move the one or more lens to create tilt motion.

FIG. 56 illustrates a SMA system including a SMA actuator according to an embodiment including bimorph actuators configured as a two axis lens shift OIS. For some embodiments, the two axis lens shift OIS is configured to move a lens in the X/Y axis. For some embodiments, Z axis movement comes from a separate AF, such as those described herein. 4 bimorph actuators push on sides of auto focus for OIS motion. FIG. 57 illustrates an exploded view of SMA system including a SMA actuator 5802 according to an embodiment including bimorph actuators 5806 configured as a two axis lens shift OIS. FIG. 58 illustrates a cross-section of SMA system including a SMA actuator 5802 according to an embodiment including bimorph actuators 5806 configured as a two axis lens shift OIS. FIG. 59 illustrates box bimorph actuator 5802 according to an embodiment for use in a SMA system configured as a two axis lens shift OIS as manufactured before it is shaped to fit in the system. Such a system can be configured to have high OIS stroke OIS (e.g., +/−200 um or more). Further, such embodiments are configured to have a broad range of motion and good OIS dynamic tilt using 4 slide bearings, such as POM slide bearings. The embodiments are configured to integrate easily with AF designs (e.g., VCM or SMA).

FIG. 60 illustrates a SMA system including a SMA actuator according to an embodiment including bimorph actuators configured as a five axis lens shift OIS and autofocus. For some embodiments, the five axis lens shift OIS and autofocus is configured to move a lens in the X/Y/Z axis. For some embodiments, pitch and yaw axis motion are for dynamic tilt tuning capability. 8 bimorph actuators are used to provide the motion for the auto focus and OIS using techniques described herein. FIG. 61 illustrates an exploded view of SMA system including a SMA actuator 6202 according to an embodiment including bimorph actuators 6204 according to an embodiment configured as a five axis lens shift OIS and autofocus. FIG. 62 illustrates a cross-section of SMA system including a SMA actuator 6202 according to an embodiment including bimorph actuators 6204 configured as a five axis lens shift OIS and autofocus. FIG. 63 illustrates box bimorph actuator 6202 according to an embodiment for use in a SMA system configured as a five axis lens shift OIS and autofocus as manufactured before it is shaped to fit in the system. Such a system can be configured to have high OIS stroke OIS (e.g., +/−200 um or more) and a high autofocus stroke (e.g., 400 um or more). Further, such embodiments enable to tune out any tilt and remove the need for a separate autofocus assembly.

FIG. 64 illustrates a SMA system including a SMA actuator according to an embodiment including bimorph actuators configured as an outward pushing box. For some embodiments, the bimorph actuators assembly is configured to wrap around an object, such as a lens carriage. Since circuit assembly is moving with the lens carriage, a flexible portion for low X/Y/Z stiffness. Tail pads of the circuit are static. The outward pushing box can be configured for both 4 or 8 bimorph actuators. So, the outward pushing box can be configured as a 4 bimorph actuator on the sides for OIS with movement in X and Y axis. The outward pushing box can be configured as a 4 bimorph actuator on the top and bottom for autofocus with movement in z axis. The outward pushing box can be configured as an 8 bimorph actuator on the top, bottom, and sides for OIS and autofocus with movement in x, y, and z axis and capable of 3-axis tilt (pitch/roll/yaw). FIG. 65 illustrates an exploded view of a SMA system including a SMA actuator 6602 according to an embodiment including bimorph actuators 6604 configured as an outward pushing box. Thus, the SMA actuator is configured such that the bimorph actuators act on the outer housing 6504 to move the lens carriage 6506 using techniques described herein. FIG. 66 illustrates a SMA system including a SMA actuator 6602 according to an embodiment including bimorph actuators configured as an outward pushing box partially shaped to receive a lens carriage 6604. FIG. 67 illustrates a SMA system including a SMA actuator 6602 including bimorph actuators 6604 according to an embodiment configured as an outward pushing box as manufactured before it is shaped to fit in the system.

FIG. 68 illustrates a SMA system including a SMA actuator 6802 according to an embodiment including bimorph actuators configured as a three axis sensor shift OIS. For some embodiments, z axis movement comes from a separate autofocus system. 4 bimorph actuators configured to push on sides of a sensor carriage 6804 to provide the motion for the OIS using techniques described herein. FIG. 69 illustrates an exploded view of SMA including a SMA actuator 6802 according to an embodiment including bimorph actuators configured as a three axis sensor shift OIS. FIG. 70 illustrates a cross-section of SMA system including a SMA actuator 6802 according to an embodiment including bimorph actuators 6806 configured as a three axis sensor shift OIS. FIG. 71 illustrates a box bimorph actuator 6802 component according to an embodiment for use in a SMA system configured as a three axis sensor shift OIS as manufactured before it is shaped to fit in the system. FIG. 72 illustrates a flexible sensor circuit for use in a SMA system according to an embodiment configured as a three axis sensor shift OIS. Such a system can be configured to have high OIS stroke OIS (e.g., +/−200 um or more) and a high autofocus stroke (e.g., 400 um or more). Further, such embodiments are configured to have a broad range of two axis motion and good OIS dynamic tilt using 4 slide bearings, such as POM slide bearings. The embodiments are configured to integrate easily with AF designs (e.g., VCM or SMA).

FIG. 73 illustrates a SMA system including a SMA actuator 7302 according to an embodiment including bimorph actuators 7304 configured as a six axis sensor shift OIS and autofocus. For some embodiments, the six axis sensor shift OIS and autofocus is configured to move a lens in the X/Y/Z/Pitch/Yaw/Roll axis. For some embodiments, pitch and yaw axis motion are for dynamic tilt tuning capability. 8 bimorph actuators are used to provide the motion for the auto focus and OIS using techniques described herein. FIG. 74 illustrates an exploded view of SMA system including a SMA actuator 7402 according to an embodiment including bimorph actuators 7404 configured as a six axis sensor shift OIS and autofocus. FIG. 75 illustrates a cross-section of SMA system including a SMA actuator 7402 according to an embodiment including bimorph actuators configured as a six axis sensor shift OIS and autofocus. FIG. 76 illustrates box bimorph actuator 7402 according to an embodiment for use in a SMA system configured as a six axis sensor shift OIS and autofocus as manufactured before it is shaped to fit in the system. FIG. 77 illustrates a flexible sensor circuit for use in a SMA system according to an embodiment configured as a three axis sensor shift OIS. Such a system can be configured to have high OIS stroke OIS (e.g., +/−200 um or more) and a high autofocus stroke (e.g., 400 um or more). Further, such embodiments enable to tune out any tilt and remove the need for a separate autofocus assembly.

FIG. 78 illustrates a SMA system including a SMA actuator according to an embodiment including bimorph actuators configured as a two axis camera tilt OIS. For some embodiments, the two axis camera tilt OIS is configured to move a camera in the Pitch/Yaw axis. 4 bimorph actuators are used to push on top and bottom of autofocus for entire camera motion for the OIS pitch and yaw motion using techniques described herein. FIG. 79 illustrates an exploded view of SMA system including a SMA actuator 7902 according to an embodiment including bimorph actuators 7904 configured as two axis camera tilt OIS. FIG. 80 illustrates a cross-section of SMA system including a SMA actuator according to an embodiment including bimorph actuators configured as a two axis camera tilt OIS. FIG. 81 illustrates box bimorph actuator according to an embodiment for use in a SMA system configured as a two axis camera tilt OIS as manufactured before it is shaped to fit in the system. FIG. 82 illustrates a flexible sensor circuit for use in a SMA system according to an embodiment configured as a two axis camera tilt OIS. Such a system can be configured to have high OIS stroke OIS (e.g., plus/minus 3 degrees or more). The embodiments are configured to integrate easily with autofocus (“AF”) designs (e.g., VCM or SMA).

FIG. 83 illustrates a SMA system including a SMA actuator according to an embodiment including bimorph actuators configured as a three axis camera tilt OIS. For some embodiments, the two axis camera tilt OIS is configured to move a camera in the Pitch/Yaw/Roll axis. 4 bimorph actuators are used to push on top and bottom of autofocus for entire camera motion for the OIS pitch and yaw motion using techniques described herein and 4 bimorph actuators are used to push on sides of autofocus for entire camera motion for the OIS roll motion using techniques described herein. FIG. 84 illustrates an exploded view of SMA system including a SMA actuator 8402 according to an embodiment including bimorph actuators 8404 configured as three axis camera tilt OIS. FIG. 85 illustrates a cross-section of SMA system including a SMA actuator according to an embodiment including bimorph actuators configured as a three axis camera tilt OIS. FIG. 86 illustrates box bimorph actuator for use in a SMA system according to an embodiment configured as a three axis camera tilt OIS as manufactured before it is shaped to fit in the system. FIG. 87 illustrates a flexible sensor circuit for use in a SMA system according to an embodiment configured as a three axis camera tilt OIS. Such a system can be configured to have high OIS stroke OIS (e.g., plus/minus 3 degrees or more). The embodiments are configured to integrate easily with AF designs (e.g., VCM or SMA).

FIG. 88 illustrates exemplary dimensions for a bimorph actuator of an SMA actuator according to embodiments. The dimensions are preferred embodiments but one skilled in the art would understand that other dimensions could be used based on desired characteristics for an SMA actuator.

FIG. 89 illustrates a lens system for a folded camera according to an embodiment. The folded camera includes a folding lens 8902 configured to bend light to a lens system 8901 including one or more lens 8903 a-d. For some embodiments, the folding lens is one or more of any of a prism and lens. The lens system 8901 is configured to have a principal axis 8904 that is at an angel to a transmission axis 8906 that is parallel to the direction of travel of the light prior to the light reaching the folding lens 8902. For example, a folded camera is used in a camera phone system to reduce the height of a lens system 8901 in the direction of a transmission axis 8906.

Embodiments of the lens system include one or more liquid lens, such as those described herein. The embodiment illustrated in FIG. 89 includes two liquid lenses 8903 b,d, such as those described herein. The one or more liquid lens 8903 b,d are configured to be actuated using techniques including those describe herein. A liquid lens is actuated using actuators, including but not limited to, buckler actuators, bimorph actuators, and other SMA actuators. FIG. 108 illustrates a liquid lens actuated using buckler actuators 60 according to an embodiment. The liquid lens includes a shaping ring coupler 64, a liquid lens assembly 61, one or more buckler actuators 60, such as those described herein, a slide base 65, and a base 62. The one or more buckler actuators 60 are configured to move the shaping ring/coupler 64 to change the shape of a flexible membrane of the liquid lens assembly 61 to move or shape the light rays, for example as described herein. For some embodiments, 3 or 4 actuators are used. A liquid lens can be configured alone or in combination with other lenses to act as an auto focus or optical image stabilizer. A liquid lens can also be configured to otherwise direct an image onto an image sensor.

FIG. 90 illustrates several embodiments of a lens systems 9001 including liquid lenses 9002 a-h to focus an image on an image sensor 9004. As illustrated, the liquid lens 9002 a-h may include any lens shape and be configured to be dynamically configured to adjust the light path through the lens using techniques including those describe herein.

A lens system for a folded camera is configured to include an actuated folding lens 9100. An example of an actuated folding lens is a prism tilt, such as that illustrated in FIG. 91. In the example illustrated in FIG. 91, the folding lens is a prism 9102 disposed on an actuator 9104. The actuator includes, but is not limited to, an SMA actuator including those described herein. For some embodiments, the prism tilt is disposed on an SMA actuator including 4 bimorph actuators 9106, such as those described herein. The actuated folding lens 9100, according to some embodiments, is configured as an optical image stabilizer using techniques including those described herein. For example, an actuated folding lens is configured to include an SMA system such as that illustrated in FIG. 39. Another example of an actuated folding lens can include an SMA actuator such as that illustrated in FIG. 21. However, the folding lens may also include other actuators.

FIG. 92 illustrates a bimorph arm with an offset according to an embodiment. The bimorph arm 9201 includes a bimorph beam 9202 having a formed offset 9203. The formed offset 9203 increases the mechanical advantage to generate a higher force than a bimorph arm without an offset. According to some embodiments, the depth of the offset 9204 (also referred herein as bend plane z offset 9204) and the length of the offset 9206 (also referred herein as trough width 9206) are configured to define characteristics of the bimorph arm, such as the peak force. For example, the graph in FIG. 106 illustrates the relationship between the bend plane z offset 9204, the trough width 9206, and the peak force of a bimorph beam 9202 according to an embodiment.

The bimorph arm includes one or more SMA materials such as an SMA ribbon or SMA wire 9210, such as those described herein. The SMA material is affixed to the beam using techniques including those describe herein. For some embodiments, the SMA material, such as an SMA wire 9210, is affixed to a fixed end 9212 of the bimorph arm and to a load point end 9214 of the bimorph arm so that the formed offset 9203 is between both ends where the SMA material is affixed. Ends of the SMA material, for various embodiments, are electrically and mechanically coupled with contacts configured to supply current to the SMA material using techniques including those known in the art. The bimorph arm with an offset can be included in SMA actuators and systems such as those described herein.

FIG. 93 illustrates a bimorph arm with an offset and a limiter according to an embodiment. The bimorph arm 9301 includes a bimorph beam 9302 having a formed offset 9303 and a limiter 9304 adjacent to the formed offset 9303. The offset 9303 increases the mechanical advantage to generate a higher force than a bimorph arm 9301 without an offset and the limiter 9304 prevents motion of the arm in direction away from the unfixed, load point end 9306 of the bimorph actuator. The bimorph arm 9301 with a formed offset 9303 and limiter 9304 can be included in SMA actuators and systems such as those described herein. The bimorph arm 9301 includes one or more SMA materials such as an SMA ribbon or SMA wire 9308, such as those described herein affixed to the bimorph arm 9301 using techniques including those described herein.

FIG. 94 illustrates a bimorph arm with an offset and a limiter according to an embodiment. The bimorph arm 9401 includes a bimorph beam 9402 having a formed offset 9403 and a limiter 9404 adjacent to the formed offset 9403. The limiter 9404 is formed as part of a base 9406 for the bimorph arm 9401. The base 9406 is configured to receive a bimorph arm 9401 and includes a recess 9408 configured to receive the offset portion of the bimorph beam. The bottom of the recess configured as a limiter 9404 to be adjacent to the formed offset 9403. The base 9406 may also include one or more portions 9410 configured to support portions of the bimorph arm when it is not actuated. The bimorph arm 9401 with a formed offset 9403 and limiter 9404 can be included in SMA actuators and systems such as those described herein. The bimorph arm 9401 includes one or more SMA materials such as an SMA ribbon or SMA wire, such as those described herein affixed to the bimorph arm 9401 using techniques including those described herein.

FIG. 95 illustrates an embodiment of a base including a bimorph arm with an offset according to an embodiment. The bimorph arm 9501 includes a bimorph beam 9502 having a formed offset 9504. The bimorph arm could also include a limiter using techniques including those described herein. The bimorph arm 9501 includes one or more SMA materials such as an SMA ribbon or SMA wire 9506, such as those described herein affixed to the bimorph arm 9501 using techniques including those described herein.

FIG. 96 illustrates an embodiment of a base 9608 including two bimorph arms with an offset according to an embodiment. Each bimorph arm 9601 a,b includes a bimorph beam 9602 a,b having a formed offset 9604 a,b. Each bimorph arm 9601 a,b includes one or more SMA materials such as an SMA ribbon or SMA wire 9606 a,b, such as those described herein affixed to the bimorph arm 9501 using techniques including those described herein. Each bimorph arm 9601 a,b could also include a limiter using techniques including those described herein. Some embodiments include a base including more than two bimorph arms formed using techniques including those described herein. According to some embodiments, the bimorph arms 9601 are integrally formed with the base 9608. For other embodiments, one or more of the bimorph arms 9602 a,b formed separately from the base 9608 and affixed to the base 9608, using techniques including, but not limited to, solder, resistance welding, laser welding, and adhesive. For some embodiments, two or more bimorph arms 9601 a,b are configured to act on a single object. This enables the ability to increase the force applied to an object. The following graph in FIG. 107 illustrates examples of how a box volume which is an approximation of a box that encompasses the entire bimorph actuator is related to the work per bimorph component. The box volume is approximated using a length of the bimorph actuator 9612, a width of the bimorph actuator 9610, and height of bimorph actuator 9614 (referred collectively as “Box Volume”).

FIG. 97 illustrates a buckler arm including load point extensions according to an embodiment. The buckler arm 9701 includes a beam portion 9702 and one or more load point extensions 9704 a,b extending from the beam portion 9702. Each end 9706 a,b of the buckler arm 9701 is configured to be affixed to or integrally formed to a plate or other base using techniques including those described herein. The one or more load point extensions 9704 a,b, according to some embodiments, are affixed or integrally formed with the beam portion 9702 at an offset from a load point 9710 a,b of the beam portion 9702. The load point 9710 a,b is the portion of the beam portion 9702 that is configured to transfer the force of the buckler arm 9701 to another object. For some embodiments, the load point 9710 a,b is the center of the beam portion 9702. For other embodiments, the load point 9710 a,b is at a position other than the center of the beam portion 9702. A load point extension 9704 a,b is configured to extend from the point it is joined to the beam portion 9702 toward the load point 9710 a,b of the beam portion 9702 in the direction of the longitudinal axis of the beam portion 9702. For some embodiments, the end of the load point extension 9704 a,b extends to at least the load point 9710 a,b of the beam portion 9702. The buckler arm 9701 includes one or more SMA materials such as an SMA ribbon or SMA wire 9712, such as those described herein. The SMA material, such as an SMA wire 9712, is affixed at opposing ends of the beam portion 9702. The SMA material is affixed to opposing ends of the beam portion using techniques including those described herein. For some embodiments, the length of the load point extensions 9704 a,b can be configured to any length contained within the longitudinal length of the associated flat (un-actuated) beam portion 9702 of the buckler arm 9701.

FIG. 98 illustrates a buckler arm 9801 including load point extensions 9810 according to an embodiment in an actuated position. The SMA material affixed to opposing ends of the beam portion 9802 is actuated using techniques including those described herein. The load point 9804 enables the buckler arm 9801 to increase the stroke range over buckler arms without the extensions. Thus, buckler arms including load point extensions enable a greater maximum vertical stroke. The buckler arm with load point extensions can be included in SMA actuators and systems such as those described herein.

FIG. 99 illustrates a bimorph arm including load point extensions according to an embodiment. The bimorph arm 9901 includes a beam portion 9902 and one or more load point extensions 9904 a,b extending from the beam portion. One end of the bimorph arm 9901 is configured to be affixed to or integrally formed to a plate or other base using techniques including those described herein. The end of the beam portion 9902 opposite the affixed or integrally formed end is not fixed and is free to move. The one or more load point extensions 9904 a,b, according to some embodiments, are affixed or integrally formed with the beam portion 9902 at an offset from the free end of the beam portion 9902. The load point extension 9904 a,b is configured to extend from the point it is joined to the beam portion 9902 in a direction away from a plane including the longitudinal axis of the beam portion 9902. For example, the one or more load point extensions 9904 a,b extend in the direction that the free end of the beam portion extends when actuated. Some embodiments of a bimorph arm 9901 include one or more load point extensions 9904 a,b having a longitudinal axis that forms an angle including 1 degree to 90 degrees with a plane including the longitudinal axis of the beam portion. For some embodiments, the end 9910 a,b of the load point extension 9904 a,b is configured to engage an object configured to be moved.

The bimorph arm 9901 includes one or more SMA materials such as an SMA ribbon or SMA wire 9906, such as those described herein. The SMA material, such as an SMA wire 9906, is affixed at opposing ends of the beam portion 9902. The SMA material is affixed to opposing ends of the beam portion 9902 using techniques including those described herein. For some embodiments, the length of the load point extensions 9904 a,b can be configured to any length. The location of the point of engagement of an object by an end 9910 a,b of the load point extension 9904 a,b, according to some embodiments, can be configured to be at any point along the longitudinal length of the beam portion 9902. The height above the beam portion of the end of a load point extension when the beam portion is flat (un-actuated) can be configured to be any height. For some embodiments, the load point extension can be configured to be at least above other portions of the bimorph arm when the bimorph arm is actuated.

FIG. 100 illustrates a bimorph arm including load point extensions according to an embodiment in an actuated position. The SMA material affixed to opposing ends of the beam portion 2 is actuated using techniques including those described herein. The load point extensions 10 enable the bimorph arm 1 to increase the stroke force over bimorph arms without the extensions. Thus, bimorph arms 1 including load point extensions 10 enable a greater force applied by the bimorph arm 1. The bimorph arm 1 with load point extensions 10 can be included in SMA actuators and systems such as those described herein.

FIG. 101 illustrates an SMA optical image stabilizer according to an embodiment. The SMA optical image stabilizer 20 includes a moving plate 22 and a static plate 24. The moving plate 22 includes spring arms 26 integrally formed with the moving plate 22. For some embodiments, the moving plate 22 and the static plate 24 are each formed to be a unitary, one-piece plate. The moving plate 22 includes a first SMA material attach portion 28 a and a second SMA material attach portion 28 b. The static plate 24 includes a first SMA material attach portion 30 a and a second SMA material attach portion 30 b. Each SMA material attach portion 28, 30 is configured to fix an SMA material, such as an SMA wire, to a plate using resistance weld joints. The first SMA material attach portion 28 a of the moving plate 22 includes a first SMA wire 32 a disposed between it and a first SMA material attach portion 30 a of the static plate and a second SMA wire 32 b disposed between it and the second SMA attach portion 30 b of the static plate 24. The second SMA material attach portion 28 b of the moving plate 22 includes a third SMA wire 32 c disposed between it and a second SMA material attach portion 30 b of the static plate and a fourth SMA wire 32 d disposed between it and the first SMA attach portion 30 a of the static plate 24. Actuating each SMA wire, using techniques including those described herein move the moving plate 22 away from the static plate 24. FIG. 102 illustrates an SMA material attach portion 40 of a moving portion according to an embodiment. The SMA material attached portion is configured to have SMA material, such as an SMA wire 41, resistance welded to the SMA material attach portion 40. FIG. 103 illustrates an SMA attach portion 42 of a static plate with resistance welded SMA wires 43 attached thereto according to an embodiment.

FIG. 104 illustrates an SMA actuator 45 including a buckle actuator according to an embodiment. The buckle actuator 46 includes buckle arms 47, such as those describe herein. The buckle arms 47 are configured to move in the z-axis when the SMA wires 48 are actuated and de-actuated using techniques including those described herein. Each SMA wire 48 is attached to a respective resistance weld wire crimps 49 using resistance welding. Each resistance weld wire crimp 49 includes an island 50 isolated from the metal 51 forming the buckle arms 47 on at least one side of the SMA wire 48. The island structure can be used in other actuators, optical image stabilizer, and auto focus systems to connect at least one side of an SMA wire to an isolated island structure formed in the base metal layer, such as the OIS application shown in FIG. 101.

FIG. 105 illustrates a resistance weld crimp including an island for an SMA actuator according to an embodiment used to attach an SMA wire 48 to a buckle actuator 46 using techniques including those describe here. FIG. 105a illustrates a bottom portion of the SMA actuator 45. The SMA actuator 45, according to some embodiments, is formed from a stainless steel base layer 51. A dielectric layer 52, such as a polyimide layer, is disposed on the bottom portion of the stainless steel base layer 51. A conductor layer 53, according to some embodiments, is electrically connected to the stainless steel island 50 through a via in the dielectric layer 52 enabling an electrical connection to be made between the wire welded to the stainless steel island 50 and the conductor circuit attached to the stainless steel island. An island 50, according to some embodiments, is etch from the stainless steel base layer. The dielectric layer 52 maintains the position of the island 50 within the stainless steel base layer 51. The island 50 is configured to attached an SMA wire thereto using techniques including those described herein, such as resistance welding. FIG. 105b illustrates a top portion of the SMA actuator 45 including an island 50. For some embodiments, glue or adhesive can also be placed on top of the weld to aid in mechanical strength and work as a fatigue strain relief during operation and shock loading.

FIG. 108 includes a lens system including an SMA actuator with buckle actuators according to an embodiment. The lens system includes a liquid lens assembly 61 disposed on a base 62. The lens system also includes a shaping ring/coupler 64 that is mechanically coupled with the buckle actuators 60. The SMA actuator including the buckle actuators 60, such as those described herein, is disposed a slide base 65 which is disposed on the base 62. The SMA actuator is configured to move the shaping ring/coupler 64 along the optical axis of the liquid lens assembly 61 by actuating the buckle actuators 60 using techniques including those described herein. This moves the shaping ring/couple 64 to change the focus of the liquid lens in the liquid lens assembly.

FIG. 109 illustrates an unfixed, load point end of a bimorph arm according to an embodiment. The unfixed, load point end 70 of a bimorph arm includes a flat surface 71 to affix SMA material, such as an SMA wire 72. The SMA wire 72 is affixed to the flat surface 71 by a resistance weld 73. The resistance weld 73 is formed using techniques including those known in the art.

FIG. 110 illustrates an unfixed, load point end of a bimorph arm according to an embodiment. The unfixed, load point end 76 of a bimorph arm includes a flat surface 77 to affix SMA material, such as an SMA wire 78. The SMA wire 78 is affixed to the flat surface 77 by a resistance weld, similar to that illustrated in FIG. 109. An adhesive 79 is disposed on the resistance weld. This enables a more reliable joint between the SMA wire 78 and the unfixed, load point end 76. The adhesive 79 includes, but is not limited to, conductive adhesive, non-conductive adhesive, and other adhesives known in the art.

FIG. 111 illustrates an unfixed, load point end of a bimorph arm according to an embodiment. The unfixed, load point end 80 of a bimorph arm includes a flat surface 81 to affix SMA material, such as an SMA wire 82. A metallic interlayer 84 is disposed on the flat surface 81. The metallic interlayer 84 includes, but is not limited to, a gold layer, a nickel layer, or alloy layer. The SMA wire 82 is affixed to the metallic interlayer 84 disposed on the flat surface 81 by a resistance weld 83. The resistance weld 83 is formed using techniques including those known in the art. The metallic interlayer 84 enables better adhesion with the unfixed, load point end 80.

FIG. 112 illustrates an unfixed, load point end of a bimorph arm according to an embodiment. The unfixed, load point end 88 of a bimorph arm includes a flat surface 89 to affix SMA material, such as an SMA wire 90. A metallic interlayer 92 is disposed on the flat surface 89. The metallic interlayer 92 includes, but is not limited to, a gold layer, a nickel layer, or alloy layer. The SMA wire 90 is affixed to the flat surface 89 by a resistance weld, similar to that illustrated in FIG. 111. An adhesive 91 is disposed on the resistance weld. This enables a more reliable joint between the SMA wire 90 and the unfixed, load point end 88. The adhesive 91 includes, but is not limited to, conductive adhesive, non-conductive adhesive, and other adhesives known in the art.

FIG. 113 illustrates a fixed end of a bimorph arm according to an embodiment. The fixed end 95 of a bimorph arm includes a flat surface 96 to affix SMA material, such as an SMA wire 97. The SMA wire 97 is affixed to the flat surface 96 by a resistance weld 98. The resistance weld 98 is formed using techniques including those known in the art.

FIG. 114 illustrates a fixed end of a bimorph arm according to an embodiment. The fixed end 120 of a bimorph arm includes a flat surface 121 to affix SMA material, such as an SMA wire 122. The SMA wire 122 is affixed to the flat surface 121 by a resistance weld, similar to that illustrated in FIG. 113. An adhesive 123 is disposed on the resistance weld. This enables a more reliable joint between the SMA wire 122 and the fixed end 120. The adhesive 123 includes, but is not limited to, conductive adhesive, non-conductive adhesive, and other adhesives known in the art.

FIG. 115 illustrates a fixed end of a bimorph arm according to an embodiment. The fixed end 126 of a bimorph arm includes a flat surface 127 to affix SMA material, such as an SMA wire 128. A metallic interlayer 130 is disposed on the flat surface 127. The metallic interlayer 130 includes, but is not limited to, a gold layer, a nickel layer, or alloy layer. The SMA wire 128 is affixed to the metallic interlayer 130 disposed on the flat surface 127 by a resistance weld 129. The resistance weld 129 is formed using techniques including those known in the art. The metallic interlayer 130 enables better adhesion with the fixed end 126.

FIG. 116 illustrates a fixed end of a bimorph arm according to an embodiment. The fixed end 135 of a bimorph arm includes a flat surface 136 to affix SMA material, such as an SMA wire 137. A metallic interlayer 138 is disposed on the flat surface 136. The metallic interlayer 136 includes, but is not limited to, a gold layer, a nickel layer, or alloy layer. The SMA wire 137 is affixed to the flat surface 136 by a resistance weld, similar to that illustrated in FIG. 115. An adhesive 139 is disposed on the resistance weld. This enables a more reliable joint between the SMA wire 137 and the fixed end 135. The adhesive 139 includes, but is not limited to, conductive adhesive, non-conductive adhesive, and other adhesives known in the art.

FIG. 117 illustrates a backside view of a fixed end of a bimorph arm according to an embodiment. The bimorph arm 143 is configured according to embodiments described herein. The fixed end 143 of a bimorph arm includes an island 144 isolated from the outer portion 145 of the fixed end 143. This enabled the island 144 to be electrically and/or thermally isolated from the outer portion 145. For some embodiments, SMA material affixed to the opposite side of the fixed end 143 of the bimorph arm is electrically coupled with the SMA material, such as an SMA wire, through a via. The island 144 is disposed on an insulator 146, such as those described herein. The island 144 can be formed using etching techniques including those known in the art.

FIG. 118 illustrates an exploded view of a buckler module tilt OIS assembly 11800, according to an embodiment. The buckler module tilt OIS assembly 11800 includes two sub-assemblies, a top buckler assembly 11820 and a bottom buckler assembly 11900. The top buckler assembly 11820 is configured to provide a yaw axis motion for dynamic tilt tuning capability. The bottom buckler assembly 11900 is configured to provide a pitch axis motion for dynamic tilt tuning capability. The buckler module tilt OIS assembly 11800 is configured into two separate sub-assemblies, each containing a two-wire buckler actuator that each move a carriage. The two buckler assemblies are implemented for efficient manufacturing and assembly.

The buckler module tilt OIS assembly 11800 includes a four-wire buckler actuator, using techniques including those described herein, for example the four-wire buckler as discussed above with reference to FIGS. 19-22. The buckler module tilt OIS assembly 11800 is operable to enable two-axis camera module OIS tilt, using techniques including those described herein, for example such as those discussed above with reference to FIGS. 78-82. Thus, the buckler module tilt OIS assembly 11800 is operable to move a heavier mass than current actuators of similar size, to move a mass to large tilt angles up to ±5°, and to move a mass at high speeds. Thus, the buckler module tilt OIS assembly 11800 enables the suppression of unwanted hand-shaking motion.

The buckler module tilt OIS assembly 11800 includes compact flexible circuits operable to enable the camera module to move/tilt in two-axis and carry the many electrical signals from the moving image sensor. This is discussed in greater detail below with respect to FIGS. 128-131 and 133-134. Furthermore, various sensors or components can be implemented herein to measure and enable feedback of the tilt position for closed loop control, including, for example, hall element sensors, TMR sensors, and resistance feedback of SMA wires that equates to actuator motion.

The buckler module tilt OIS assembly 11800 includes an AF assembly with sensor bracket 11840, a sensor circuit PCB 11860, and a module circuit PCB 11880 sandwiched between the top buckler assembly 11820 and the bottom buckler assembly 11900. The moving mass includes the AF assembly with sensor bracket 11840, the sensor circuit PCB 11860, and the module circuit PCB 11880. The top buckler assembly 11820 is configured to receive the AF assembly with sensor bracket 11840 and the sensor circuit PCB 11860. This is discussed in greater detail below with respect to FIGS. 124A and 124B. It is noted that buckler module tilt OIS assembly 11800 may include many more or less components than shown in FIG. 118; however, those shown are sufficient to disclose illustrative embodiments for practicing the subject innovations. In some examples, the module being moved is a full camera module. Thus, the buckler module tilt OIS assembly 11800 includes the image sensor on a PCB, an autofocus (AF) module, and the camera lenses. It should be understood, however, that the present disclosure and example embodiments can be implemented in varying technologies.

FIG. 119 illustrates an assembled view of the buckler module tilt OIS assembly 11800, according to an embodiment. The buckler module tilt OIS assembly 11800 may be configured to fit in a footprint of up to 14.5 mm by 14.5-16.5 mm. For reference, the AF assembly with sensor bracket 11840 has a footprint of approximately 10 mm by 10 mm. FIG. 135 illustrates a footprint of the dimensions of the AF assembly with sensor bracket 11840, according to an embodiment. As a result, some embodiments of the buckler module tilt OIS assembly 11800 has a 4.5 mm larger footprint of the AF assembly with sensor bracket 11840.

FIG. 120 illustrates forces applied to the buckler module tilt OIS assembly 11800, according to an embodiment. The top buckler assembly 11820 includes buckler arms 11833, each positioned to cause the top buckler assembly 11820 to generate a yaw axis motion. The bottom buckler assembly 11900 includes buckler arms 11813, each positioned to cause the bottom buckler assembly 11900 to generate a pitch axis motion. As a result, the top buckler assembly 11820 and the bottom buckler assembly 11900 are pushing away from each other to provide the dynamic tilting of the buckler module tilt OIS assembly 11800. The top buckler assembly 11820 provides an upward force (yaw) 11830 while the bottom buckler assembly 11900 provides a downward force (pitch) 11810. The buckler module tilt OIS assembly 11800, according to some embodiments, is operable to connect to SMA wires and hall sensors directly via the module circuit PCB 11880.

The push force of some of the embodiments have 10 times or more push force than current technologies. An example of the push force of the top buckler assembly 11820 and the bottom buckler assembly 11900 is between 20-30 grams. This enables a higher frequency response rate of the buckler module tilt OIS assembly 11800 when used with objects having a greater mass. As a result, the disclosed embodiments have a smaller footprint than current technologies and can move a greater mass.

FIG. 121 illustrates a tilting resulting from the forces applied to the buckler module tilt OIS assembly 11800, according to an embodiment. The AF assembly with sensor bracket 11840 is shown tilted at an angle θ. In some examples, the angle θ can be about 5 degrees off center. The AF assembly with sensor bracket 11840 is operable to move up and down about 0.56 mm according to some embodiments. Furthermore, the AF assembly with sensor bracket 11840 is operable to move side to side about 0.155 mm for some embodiments. The buckler module tilt OIS assembly 11800, according to some embodiments, provides clearance for the relative motion of the AF assembly with sensor bracket 11840.

FIG. 122 illustrates an exploded view of a top buckler assembly 11820 of the buckler module tilt OIS assembly 11800, according to an embodiment. The top buckler assembly 11820 can include a housing with a top spring 11920, a top AF carriage 11940, a flexible sensor circuit 11960, and a yaw tilt sub-assembly 11980. The yaw tilt sub-assembly 11980 includes a tilt sub-assembly buckler frame 11910, a stainless-steel SST buckler frame 11930, slide bearings 11950, at least one SMA wire 11970, and an SST slide base 11990. For some embodiments, the slide bearings 11950 are formed of polyoxymethylene (“POM bearings”).

FIG. 123 illustrates an exploded view of the bottom buckler assembly 11900 of the buckler module tilt OIS assembly 11800, according to an embodiment. The bottom buckler assembly 11900 can include a housing with a bottom spring 12000, a bottom AF carriage 12020, and a pitch tilt sub-assembly 12040. The pitch tilt sub-assembly 12040 includes a tilt sub-assembly buckler frame 12010, a stainless-steel SST buckler frame 12030, bearings, a SMA wire 12070, and an SST slide base 12030.

FIG. 124A illustrates an exploded view of a partially assembled buckler module tilt OIS assembly 11801, according to an embodiment. The AF assembly with a sensor bracket 11840 inserted from below and fixed to the top buckler assembly 11820. In some examples, the AF assembly with sensor bracket 11840 is fixed to the top buckler assembly 11820 via adhesive, solder welds, or other known processes of mounting sub-components. FIG. 124B illustrates an assembled view of the partially assembled buckler module tilt OIS assembly 11801, according to an embodiment. The AF assembly with sensor bracket 11840 is coupled to the sensor circuit PCB 11860. Sensor circuit connections 12120 are facilitated between the sensor circuit PCB 11860 and the AF assembly with sensor bracket 11840 upon coupling both components.

FIG. 125 illustrates a front view of the partially assembled buckler module tilt OIS assembly 11801, according to an embodiment. The sensor circuit PCB 11860 is connected to the AF assembly with sensor bracket 11840 from below. The sensor circuit PCB 11860 can be fixed to the AF assembly with sensor bracket 11840 via solder welds 12124 and 12122, or other known processes of mounting sub-components.

FIG. 126 illustrates the assembly process of the buckler module tilt OIS assembly 11800, according to an embodiment. As discussed above, the AF assembly with sensor bracket is inserted from below and fixed to the top buckler assembly 11820, which forms the partially assembled buckler module tilt OIS assembly 11801 (moving mass). At this point the many electrical connection points are still exposed and can be joined together (typically with solder). The module circuit PCB 11880 is coupled to the partially assembled buckler module tilt OIS assembly 11801 from below.

FIG. 127 illustrates the coupling of the module circuit PCB 11880 to the partially assembled buckler module tilt OIS assembly 11801, according to an embodiment. Furthermore, the bottom buckler assembly 11900 is coupled to the module circuit PCB and the partially assembled buckler module tilt OIS assembly from below, to form the buckler module tilt OIS assembly 11800. The bottom buckler assembly 11900 is then attached to both the top buckler assembly 11820 along the fixed perimeter and the bottom buckler assembly 11900 carriage is attached to the bottom of the partially assembled buckler module tilt OIS assembly 11801.

FIG. 128 illustrates flexible sensor circuit 11909 of the buckler module tilt OIS assembly 11800, according to an embodiment. FIG. 129 illustrates the flexible sensor circuit 11909 of the buckler module tilt OIS assembly 11800, according to an embodiment. The flexible sensor circuit 11909 can have a fixed connection to the module circuit PCB 11880 at a first end. The flexible sensor circuit 11909 can include sensor circuit connections 12120 at a second end.

FIG. 130 illustrates flexible sensor circuits of the buckler module tilt OIS assembly 12500, according to an alternative embodiment. The buckler module tilt OIS assembly 12500 includes two flexible sensor circuits 11908 and 11909. The two flexible sensor circuits 11908 and 11909 are separated by a flexible section 12501 to allow for two-axis motion for the buckler module tilt OIS assembly 12500. Other embodiments include buckler module tilt OIS assemblies including more than two flexible sensor circuits. FIG. 131 illustrates the flexible sensor circuits of the buckler module tilt OIS assembly 12500, according to an alternative embodiment. As illustrated herein, a first end of the flexible sensor circuits 11908 is mounted to a fixed module circuit PCB 12880. A second end of the flexible sensor circuits 11908 is mounted to a sensor circuit PCB 11860, which is not fixed and operable to move. Likewise, a first end of the flexible sensor circuits 11909 is mounted to a fixed module circuit PCB 12880. A second end of the flexible sensor circuits 11909 is mounted to a sensor circuit PCB 11860, which is not fixed and operable to move. Each of the flexible sensor circuits 11908 and 11909 includes one or more flexible regions 12502, such that the flexible sensor circuits are able to move with the moving components of the buckler module tilt OIS assembly 12500.

FIG. 132 illustrates an assembled view of a buckler module tilt OIS assembly 13200, according to an alternative embodiment. The buckler module tilt OIS assembly 13200 includes a top buckler assembly 13220. The top buckler assembly 13220 includes buckler arms 13233, each positioned downward to cause the top buckler assembly 13220 to generate a pitch axis motion in the downward direction. The buckler module tilt OIS assembly 13200 also includes a bottom buckler assembly 13230.

The bottom buckler assembly 13230 includes buckler arms 13213, each positioned to cause the bottom buckler assembly 13230 to generate a yaw axis motion, in the upward direction. As a result, the top buckler assembly 13220 and the bottom buckler assembly 13230 are pushing towards each other to provide the dynamic tilting of the buckler module tilt OIS assembly 13200. The top buckler assembly 13230 provides a downward force (pitch) while the bottom buckler assembly 13230 provides an upward force (yaw).

FIG. 133 illustrates a buckler module tilt OIS assembly 13300, according to an alternative embodiment. FIG. 134 illustrates an underside of the assembled view of a buckler module tilt OIS assembly 13300. The buckler module tilt OIS assembly 13300 includes long flexible circuit 13301 extending directly from the sensor circuit PCB 13360. The flexible circuit extends from the sensor circuit PCB 13360 to enable two-axis motion. The buckler module tilt OIS assembly 13300 would include four-wire buckler system to tilt the camera for OIS, according to embodiments discussed herein.

FIG. 136 illustrates a SMA module tilt OIS assembly 13600, according to an embodiment. FIG. 137 illustrates the SMA module tilt OIS assembly 13600 under directional deformity, according to an embodiment. The SMA module tilt OIS assembly 13600 incorporates a four-wire Buckler tilts camera module, which enables movement in the Pitch and Yaw direction using techniques including those described herein. The bottom two-wires are operable to be driven differentially for pitch tilt using techniques including those described herein. Moreover, the top two-wires are operable to be driven differentially for yaw tilt. The movement of the sub-assemblies enable the SMA module tilt OIS assembly 13600 to generate up to ±4.9° tilt, as demonstrated herein. Moreover, the buckler push force is more than or equal to 20 grams. This configuration is ideal for moving heavy masses at higher frequencies and amplitudes.

FIG. 138 illustrates a flexible sensor circuit 13700 of the buckler module tilt OIS assembly 13600, according to an alternative embodiment. The flexible sensor circuit 13700 is operable to carry signals from the image sensor to a PCB or other circuit external to the sensor.

FIG. 139 illustrates a buckler module tilt OIS assembly 1 including a single housing according to an embodiment. The housing 2 is configured to include a top buckler assembly, according to embodiments described herein, and a bottom buckler assembly, according to embodiments described herein, withing the housing 2. The housing 2 is configured to receive a flexible printed circuit 3 on an outer surface of the housing 2. The flexible printed circuit 3 is configured to include one or more position sensors 22 configured to enable closed loop control using techniques including those described herein. For some embodiments, the one or more sensors are hall element sensors. For some embodiments the flexible printed circuit 3 is configured to include one or more integrated circuits, such as an OIS driver.

FIG. 140 illustrates an exploded view of an a buckler module tilt OIS assembly 1 including a single housing according to an embodiment. The buckler module tilt OIS assembly 1 includes a top return spring 4 configured to generate a return torque to aid in tilt stroke stability. The top return spring 4 is disposed on a top autofocus carriage 5 of the top buckler assembly according to some embodiments. The top autofocus carriage 5 is configured to receive a top portion of a module. For some embodiments, the module is an autofocus and image sensor module 21. The top buckler assembly 6 also includes a buckler actuator 7 such as those described herein. The buckler actuator 6 is configured using techniques including those described herein. The top buckler assembly 6, according to some embodiments, includes one or more bearings 8 such as those that are described herein. The top buckler assembly 6 includes one or more SMA wires 9 similar to those described herein. The one or more SMA wires 9 are configured to actuate the buckler actuator 7 using techniques including those described herein.

The buckler module tilt OIS assembly also includes bottom buckler assembly 11. The bottom buckler assembly 11 includes a buckler actuator 12 such as those described herein. The buckler actuator 12 is configured using techniques including those described herein. For some embodiments, the buckler actuator 12 is a different type of SMA actuator than the buckler actuator 11 of the top buckler assembly 6. The bottom buckler assembly 11, according to some embodiments, includes one or more bearings 13 such as those that are described herein. The bottom buckler assembly 11 includes one or more SMA wires 14 similar to those described herein. The one or more SMA wires 14 are configured to actuate the buckler actuator 12 using techniques including those described herein. The top buckler assembly 6, according to some embodiments, is disposed on the bottom buckler assembly 11.

The buckler module tilt OIS assembly according the embodiment illustrated in FIG. 140 includes a bottom autofocus carriage 16. The bottom autofocus carriage 16 is configured to receive a bottom portion of the module, such as a an autofocus and image sensor module 21. The bottom autofocus carriage 16 are configured to receive one or more magnets 15. The one or more magnets 15 are aligned with a respective position sensor included in the flexible printed circuit 3 as part of a closed loop control using techniques including those described herein. The one or more magnets 15 and the one or more position sensors 22 are configured to enable information about the tilt and height or z-axis position of the module, such as an autofocus and image sensor module 21.

The buckler module tilt OIS assembly includes a bottom spring 17. The bottom spring 17 is configured to receive the bottom autofocus carriage 16. A sensor circuit 18 is configured to electrically couple the module to power and circuits outside the module. The sensor circuit 18, according to some embodiments, is also configured to electrically coupled the one or more position sensors and any integrated circuit, such as an OIS driver, through the flexible printed circuit 3. For some embodiments, the sensor circuit 18 is a flexible circuit including conductive traces to electrically couple the one or more position sensors, any integrated circuits, and/or the module. The flexible circuit enables the module to be moved by the top buckler assembly 6 and the bottom buckler assembly 7 without damaging the conductive traces. The sensor circuit 18 is disposed on a base cap 19. The base cap 19 is configured to mate with the housing 1 using techniques including those known in the art.

FIG. 141 illustrates a buckler module tilt OIS according to an embodiment. The buckler module tilt OIS 23 includes a top buckler assembly 24, such as those described herein, and a bottom buckler assembly 25, such as those described herein. The buckler module tilt OIS 23 includes a module circuit printed circuit board (PCB) 26 configured to include one or more position sensors, such as those described herein. As illustrated in FIG. 141 an yaw tilt sub-assembly, such as those described herein, of the top buckler assembly 24 is configured to have a high force 27 on one side and a low force 28 on the other side to enable a tilt of a module in a first direction. For this example of tilting in a first direction, the pitch tilt sub-assembly, such as those described herein, of the bottom buckler assembly 25 is configured to have a medium force on both sides to act as a pivot for the tilt motion, according to some embodiments. Using similar techniques, the buckler module tilt OIS 23 is configured to move the module in many positions.

FIG. 142 illustrates internal components, such as those described herein, of a buckler module tilt OIS 30 according to an embodiment. The buckler module tilt OIS 30 includes a top spring 31 and a bottom spring 32. The top spring 31 and the bottom spring 32 are configured to have similar stiffness. For some embodiments, the stiffness of the top spring 31 and the bottom spring 32 is 61 milli-Newtons-millimeter/degree. However, one skilled in the art would understand the stiffness can be configured to any desired stiffness by adjusting the material of the springs and/or the thickness of the material.

FIG. 143 illustrates a top spring according to an embodiment. The top spring 33 includes one or more spring arms 34 a-d. The top spring 33 is configured to generate a return torque to aid in tilt stroke stability of a buckler module tilt OIS according to embodiments. FIG. 144 illustrates a bottom spring 35 according to an embodiment. The bottom spring 35 is configured to generate a return torque to aid in tilt stroke stability of a buckler module tilt OIS according to embodiments. For some embodiments, the material of the top spring 33 and the bottom spring 35 are formed of a 302/304 stainless steel having a thickness of 50 microns and a spring arm width of 120 microns.

FIG. 145 illustrates a flexible sensor circuit coupled to a module of a buckler module tilt OIS assembly according to an embodiment. The buckler module tilt OIS is configured according to embodiments described herein. The flexible sensor circuit 37 is electrically coupled with a bottom of a module 38 at a first end of the flexible sensor circuit 37, such as those described herein. The flexible sensor circuit 38 configured to have a first set of traces 39 and a second set of traces 40. The first set of traces 39 extend from a first pad 46 and is electrically coupled to a first portion of module 38 through the first pad 46 of the flexible sensor circuit 37. The second set of traces 40 extend from a second pad 47 and is electrically coupled to a first portion of module 38 through a second pad 47 of the flexible sensor circuit 37. The second end of the first set of traces 39 is configured to terminate at a first terminal pad 44 disposed in a terminal pad portion 42 of the single housing 43. The second end of the second set of traces 39 is configured to terminate at a second terminal pad 45 disposed in a terminal pad portion 42 on a side of the single housing 43. The terminal pad portion 42 of the single housing 43 is configured to with a one or more connectors of a circuit board to electrically couple the module and other circuits of the buckler module tilt OIS assembly to other circuits.

For some embodiments, the first terminal pad 46 and the second terminal pad 47 are formed on a same base layer. For other embodiments, the first terminal pad 46 and the second terminal pad 47 are formed on a physically separate base layers. The configuration of the flexible sensor circuit 37 enables soldering the connections of the first pad 46, the second pad 47, the first terminal pad 44, and the second terminal pad 45 at the same time. Further, the flexible sensor circuit 37 is configured to have many electrical traces in a small size and with a low stiffness to minimize impact during the movement of the module 38.

FIG. 146 illustrates a flexible sensor circuit according to the embodiment illustrated in FIG. 145 including a base cap 48, such as those described herein. The base cap is configured to mate with the single housing 43 using techniques including those known in the art. The base cap 48 includes a terminal cover portion 49 is configured to cover the first terminal pad 44 and the second terminal pad 45.

FIG. 147 illustrates a buckler module tilt OIS assembly according to an embodiment without a housing and base cap. The buckler module tilt OIS 50 includes a flexible sensor circuit 51, such as those described herein, including a first set of traces and a second set of traces. The flexible sensor circuit 51 is configured to minimize bias between pitch and yaw stiffness and to have a low force impact on the movement of the module, such as those described herein. According to some embodiments the first terminal pad and the second terminal pad extends no more than 1 millimeter from the side of the module. However, one skilled in the art would understand that the terminal pads could extend beyond 1 millimeters if desired.

For some embodiments, the flexible sensor circuit 51 is formed of one or more stainless steel base layers. The stainless steel base layer, for some embodiments, is formed having a thickness of 18 microns. The stainless steel base layer includes a dielectric layer, such as a polyimide layer. Further, the traces and plurality of contact pads of the first pad, the second pad, the first terminal pad, and the second terminal pad are formed from a conductor layer disposed on the dielectric layer. For some embodiments, the conductor layer is a copper layer, however, other conductive materials may be used. The flexible sensor circuit, for some embodiments, includes a second dielectric layer disposed on the conductor layer. For some embodiments, the conductor layer is formed to have a thickness of 12 microns or 24 microns. However, other embodiments include a conductor layer having other thickness. The second dielectric layer, for some embodiments, is a polyimide layer. For some embodiments, the second dielectric layer is formed to have a thickness of 5 to 7 microns. However, other embodiments include a second dielectric layer having other thickness. The flexible sensor circuit, according to embodiments, is configured to have a thickness less than or equal to 0.05 millimeters and includes electrical traces with a width less than or equal to 0.015 millimeters. The base layer of the flexible sensor circuit includes a base layer that is configured to be formable and retain the shape of the flexible sensor circuit.

FIG. 148 illustrates a bottom view of a module including a flexible sensor circuit according to an embodiment. The module 52 includes a flexible sensor circuit 53 configured according to embodiments described herein. The flexible sensor circuit 53, for some embodiments, is configured to have a pitch stiffness and a yaw stiffness less than or equal to 38 milli-Newtons-millimeters per degree. For some embodiments, the flexible sensor circuit 53 is configured to have a pitch stiffness is less than or equal to 38 milli-Newtons-millimeters per degree and a yaw stiffness of less than or equal to 24 milli-Newtons-millimeters per degree.

FIG. 149 illustrates a side view and a bottom view of a module including a flexible sensor circuit according to an embodiment. The module 54 includes a flexible sensor circuit 55 configured according to embodiments described herein. The first set of traces 56 and the second set of traces 58 are configured be disposed on the outside of the first pad 57 and the second pad 59, respectively. FIG. 150 illustrates a side view and a bottom view of a module including a flexible sensor circuit according to an embodiment. The module 61 includes a flexible sensor circuit 64 configured according to embodiments described herein. The first set of traces 63 and the second set of traces 66 are configured be disposed on the outside of the first pad 62 and the second pad 65. For some embodiments, the first set of traces 63 and the second set of traces 66 each include at least one bend, such as a first bend 68 and a second bend 69. For some embodiments the bend is equal to or greater than six degrees from the surface of the module. However, the bend could be of any other value. The first bend 68 and the second bend 69 are configured to minimize any contact with the module and or any other component of a buckler module tilt OIS, such as a base cap, during movement.

It will be understood that terms such as “top,” “bottom,” “above,” “below,” and x-direction, y-direction, and z-direction as used herein as terms of convenience that denote the spatial relationships of parts relative to each other rather than to any specific spatial or gravitational orientation. Thus, the terms are intended to encompass an assembly of component parts regardless of whether the assembly is oriented in the particular orientation shown in the drawings and described in the specification, upside down from that orientation, or any other rotational variation.

It will be appreciated that the term “present invention” as used herein should not be construed to mean that only a single invention having a single essential element or group of elements is presented. Similarly, it will also be appreciated that the term “present invention” encompasses a number of separate innovations, which can each be considered separate inventions. Although the present invention has been described in detail with regards to the preferred embodiments and drawings thereof, it should be apparent to those skilled in the art that various adaptations and modifications of embodiments of the present invention may be accomplished without departing from the spirit and the scope of the invention. Additionally, the techniques described herein could be used to make a device having two, three, four, five, six, or more generally n number of bimorph actuators and buckle actuators. Accordingly, it is to be understood that the detailed description and the accompanying drawings as set forth hereinabove are not intended to limit the breadth of the present invention, which should be inferred only from the following claims and their appropriately construed legal equivalents. 

What is claimed is:
 1. A buckler module tilt OIS assembly comprising: a top buckler assembly, configured to provide a yaw axis motion for tilt capability, comprising a housing with a top spring, a top auto focus (AF) carriage and a yaw tilt sub-assembly; a bottom buckler assembly configured to provide a pitch axis motion for tilt capability; and a flexible sensor circuit to provide connections to an image sensor.
 2. The buckler module tilt OIS assembly of claim 1, wherein the top buckler assembly includes a two-wire actuator.
 3. The buckler module tilt OIS assembly of claim 1, wherein the bottom buckler assembly includes a two-wire actuator.
 4. The buckler module tilt OIS assembly of claim 1, wherein the buckler module tilt OIS assembly is operable to provide two-axis camera module OIS tilt to move a moving mass to move to large tilt angles up to ±5°.
 5. The buckler module tilt OIS assembly of claim 4, wherein the moving mass includes an auto focus assembly, a sensor circuit PCB, and a module circuit PCB.
 6. The buckler module tilt OIS assembly of claim 4, wherein an auto focus assembly is fixed to the top buckler assembly via adhesive.
 7. The buckler module tilt OIS assembly of claim 1, further comprising an auto focus AF assembly, a sensor circuit PCB, and a module circuit PCB positioned between the top buckler assembly and the bottom buckler assembly.
 8. The buckler module tilt OIS assembly of claim 7, wherein the top buckler assembly is configured to receive the AF assembly and the sensor circuit PCB.
 9. The buckler module tilt OIS assembly of claim 1, wherein the buckler module tilt OIS assembly is configured to fit in a footprint of up to 14.5 mm in length by up to 14.5 mm in width.
 10. The buckler module tilt OIS assembly of claim 1, wherein the top buckler assembly includes one or more buckler arms, each buckler arm is positioned to cause the top buckler assembly to generate a yaw axis motion.
 11. The buckler module tilt OIS assembly of claim 10, wherein the bottom buckler assembly includes one or more buckler arms, each positioned to cause the bottom buckler assembly to generate a pitch axis motion.
 12. The buckler module tilt OIS assembly of claim 11, wherein the top buckler assembly and the bottom buckler assembly are operable to push away from each other to provide dynamic tilting of the buckler module tilt OIS assembly.
 13. The buckler module tilt OIS assembly of claim 1, wherein the push force of the top buckler assembly and the bottom buckler assembly is between 20-30 grams.
 14. The buckler module tilt OIS assembly of claim 1, wherein the yaw tilt sub-assembly includes a tilt sub-assembly buckler frame, a stainless-steel (SST) buckler frame, more than one slide bearings, at least one SMA wire, and an SST slide base.
 15. The buckler module tilt OIS assembly of claim 1, comprising a single housing and a base cap, the base cap configured to mate with the single housing.
 16. The buckler module tilt OIS assembly of claim 15, comprising a flexible printed circuit configured to be disposed on the outer surface of the single housing.
 17. The buckler module tilt OIS assembly of claim 16, wherein the flexible printed circuit is configured to include one or more position sensors.
 18. The buckler module tilt OIS assembly of claim 16, comprising a module and the flexible sensor circuit electrically coupled with the module.
 19. The buckler module tilt OIS assembly of claim 18, wherein the flexible sensor circuit includes a first set of traces configured to extend from a first pad and a second set of traces configured to extend from a second pad.
 20. The buckler module tilt OIS assembly of claim 18, wherein the flexible sensor circuit includes a first set of traces configured to be disposed on the outside of a first pad and a second pad, respectively.
 21. The buckler module tilt OIS assembly of claim 18, wherein the flexible sensor circuit includes a first set of traces configured to be disposed on the inside of the first pad and the second pad, respectively.
 22. The buckler module tilt OIS assembly of claim 16, wherein the flexible sensor circuit electrically includes one or more bends.
 23. A buckler module tilt OIS assembly comprising: a top buckler assembly configured to provide yaw axis motion for tilt suppression capability; and a bottom buckler assembly, configured to provide pitch axis motion for pitch tilt suppression capability, includes a housing with a bottom spring, a bottom AF carriage, and a pitch tilt sub-assembly.
 24. The buckler module tilt OIS assembly of claim 23, wherein the pitch tilt sub-assembly includes a tilt sub-assembly buckler frame, a stainless-steel (SST) buckler frame, more than one slide bearings, at least one SMA wire, and an SST slide base.
 25. A method of manufacturing the buckler module tilt OIS assembly of claim 1 comprising: providing a top buckler assembly configured to provide a yaw axis motion for yaw tilt suppression capability; mounting an auto focus assembly to the top buckler assembly; mounting a sensor circuit PCB to the auto focus assembly at a side opposite of the top buckler assembly; thereby facilitating sensor circuit connections between the sensor circuit PCB and the auto focus assembly with a sensor bracket; coupling a bottom buckler assembly to a module circuit PCB opposite the auto focus assembly, the flexible sensor circuit comprising the sensor circuit PCB and the module circuit PCB; and attaching the bottom buckler assembly to the top buckler assembly along the fixed perimeter.
 26. The method of claim 25, wherein the top buckler assembly includes a two-wire actuator.
 27. The method of claim 25, wherein the bottom buckler assembly includes a two-wire actuator. 